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FGH60N60SMD-F085

Onsemi

FGH60N60SMD-F085 by Onsemi

FGH60N60SMD-F085 by Onsemi is an N-CHANNEL IGBT with 600V VCE, 120A IC, and 600W Ptot. Ideal for power control applications due to its fast tr of 60ns and tf of 20ns. Its single configuration with built-in diode makes it suitable for high-power switching needs.

Median Price

$6.610

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$6.610

100+ parts

$4.990

1k+ parts

$4.250

10k+ parts

-

2

$6.610

$4.990

$4.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$4.148

100+ parts

-

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88

$4.148

-

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Digiode

USA . 3,008 parts In-Stock

1+ parts

$6.280

100+ parts

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3,008

$6.280

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Vyrian

USA . 4,141 parts In-Stock

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4,141

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Distributors (Availability)

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Advanced Electronics

New Zealand . 80 parts In-Stock

1+ parts

$0.575

100+ parts

$0.546

1k+ parts

$0.546

10k+ parts

-

80

$0.575

$0.546

$0.546

-

Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$1.897

100+ parts

-

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-

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1,000

$1.897

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Continental Prestige Electronics

USA . 7,265 parts In-Stock

1+ parts

$3.877

100+ parts

-

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10k+ parts

$3.799

7,265

$3.877

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-

$3.799

Argo Parts USA

USA . 6,288 parts In-Stock

1+ parts

$3.877

100+ parts

-

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6,288

$3.877

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Corohmni

South Africa . 274 parts In-Stock

1+ parts

$4.066

100+ parts

-

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274

$4.066

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Netroflash

USA . 500 parts In-Stock

1+ parts

$4.148

100+ parts

$4.066

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-

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500

$4.148

$4.066

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-

Semicontronic

India . 6 parts In-Stock

1+ parts

$5.620

100+ parts

$5.480

1k+ parts

$5.451

10k+ parts

-

6

$5.620

$5.480

$5.451

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Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$5.620

100+ parts

-

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4

$5.620

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Corphita

USA . 1,279 parts In-Stock

1+ parts

$5.949

100+ parts

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1,279

$5.949

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AZTECH Wire

Italy . 1,156 parts In-Stock

1+ parts

$17.518

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1,156

$17.518

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Component Stockers USA

USA . 466 parts In-Stock

1+ parts

$99.990

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466

$99.990

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Problanco Electronics

Mexico . 6,690 parts In-Stock

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6,690

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Kulean Microsystems

USA . 6,460 parts In-Stock

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6,460

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SupplyDigital Components

Austria . 5,044 parts In-Stock

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5,044

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TANS Electronics

Latvia . 3,246 parts In-Stock

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3,246

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Supply Digital

USA . 777 parts In-Stock

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777

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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447

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Perfect Parts

USA . 239 parts In-Stock

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239

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Overview

Upgrade your power control systems with the FGH60N60SMD-F085 from Onsemi. As a leading manufacturer of Insulated Gate Bipolar Transistors (IGBT), Onsemi ensures top-notch quality and reliability in each component they produce. This single N-channel IGBT with built-in diode is perfect for various applications requiring efficient power control. With a maximum power dissipation of 600 W and maximum collector current of 120 A, this transistor offers unparalleled performance and durability. Trust Onsemi to deliver superior technology that exceeds expectations. Elevate your power control systems with the FGH60N60SMD-F085 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Enhances the efficiency and performance of the transistor in power control applications.

Maximum Power Dissipation (Abs): 600 W

Capable of handling high power levels, making it suitable for demanding power control tasks.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, allowing for versatile use in various power control applications.

Maximum Collector Current (IC): 120 A

Capable of handling high current levels, making it suitable for applications that require a significant amount of power.

Reference Standard: AEC-Q101

Adheres to a recognized industry standard, ensuring quality and reliability in performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH60N60SMD-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

20 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

60 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

139 ns

Nominal Turn On Time (ton):

66 ns

Trade Compliance

FGH60N60SMD-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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