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FGH60T65SQD-F155

Onsemi

FGH60T65SQD-F155 by Onsemi

FGH60T65SQD-F155 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and IC of 120A, ideal for POWER CONTROL applications. Featuring a package style of FLANGE MOUNT, it has a max operating temperature of 175°C and collector-emitter voltage of 650V.

Median Price

$6.320

Lifecycle Status

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14

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 437 parts In-Stock

1+ parts

$5.470

100+ parts

$2.600

1k+ parts

$2.450

10k+ parts

-

437

$5.470

$2.600

$2.450

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Mouser Electronics

USA . 277 parts In-Stock

1+ parts

$6.320

100+ parts

$3.020

1k+ parts

$2.900

10k+ parts

-

277

$6.320

$3.020

$2.900

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DigiKey

USA . 259 parts In-Stock

1+ parts

$6.370

100+ parts

$3.628

1k+ parts

$2.584

10k+ parts

$2.530

259

$6.370

$3.628

$2.584

$2.530

Newark

USA . 14 parts In-Stock

1+ parts

$7.060

100+ parts

$4.300

1k+ parts

$3.970

10k+ parts

-

14

$7.060

$4.300

$3.970

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Element14

Singapore . 437 parts In-Stock

1+ parts

$9.210

100+ parts

$4.210

1k+ parts

$4.050

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-

437

$9.210

$4.210

$4.050

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Verical

USA . 10,350 parts In-Stock

1+ parts

-

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-

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$2.546

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10,350

-

-

$2.546

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Rochester

USA . 126 parts In-Stock

1+ parts

-

100+ parts

$2.530

1k+ parts

$2.260

10k+ parts

$2.130

126

-

$2.530

$2.260

$2.130

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,882 parts In-Stock

1+ parts

$2.670

100+ parts

-

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-

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1,882

$2.670

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-

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Maritex

Poland . 271 parts In-Stock

1+ parts

$5.943

100+ parts

$3.587

1k+ parts

$3.031

10k+ parts

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271

$5.943

$3.587

$3.031

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Chip Stock

USA . 20,040 parts In-Stock

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20,040

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Flip Electronics

USA . 14,850 parts In-Stock

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14,850

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Vyrian

USA . 11,896 parts In-Stock

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11,896

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Cyclops Electronics Ltd

UK . 331 parts In-Stock

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331

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Corohmni

South Africa . 101 parts In-Stock

1+ parts

$0.901

100+ parts

-

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101

$0.901

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Ampacity Inc.

Singapore . 2,213 parts In-Stock

1+ parts

$2.390

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-

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2,213

$2.390

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Corphita

USA . 1,834 parts In-Stock

1+ parts

$2.529

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1,834

$2.529

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Continental Prestige Electronics

USA . 770 parts In-Stock

1+ parts

$4.700

100+ parts

$3.520

1k+ parts

-

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770

$4.700

$3.520

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Microchip USA

USA . 2,334 parts In-Stock

1+ parts

$19.880

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2,334

$19.880

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TANS Electronics

Latvia . 6,807 parts In-Stock

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6,807

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Problanco Electronics

Mexico . 6,078 parts In-Stock

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6,078

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SupplyDigital Components

Austria . 5,365 parts In-Stock

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Kepictronics

USA . 4,100 parts In-Stock

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Kulean Microsystems

USA . 3,190 parts In-Stock

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Perfect Parts

USA . 1,060 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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170

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Overview

Unleash the power of innovation with Onsemi's FGH60T65SQD-F155 Insulated Gate Bipolar Transistor. Designed for high-performance power control applications, this N-CHANNEL transistor offers unparalleled quality and reliability. With a maximum VCEsat of 2.1V and a maximum operating temperature of 175°C, this transistor is a game-changer in the industry. Whether you're looking to optimize your power electronics or enhance your industrial machinery, this single with built-in diode transistor provides the value, benefits, and advantages you need to take your projects to the next level. Elevate your designs with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation and protection for the internal components.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and low on-state voltage drop.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and improves overall efficiency by integrating a diode into the transistor.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable performance.

Maximum VCEsat: 2.1 V

Low saturation voltage helps reduce power losses and improve efficiency.

Package Shape: RECTANGULAR

Allows for easy mounting and integration in various electrical systems.

Terminal Form: THROUGH-HOLE

Ensures secure and reliable connections in a through-hole mounting configuration.

Nominal Turn Off Time (toff): 126.2 ns

Fast turn-off time enhances switching speed and efficiency.

No. of Terminals: 3

Provides necessary connections for proper functionality.

Maximum Power Dissipation (Abs): 333 W

High power dissipation capability allows for handling large loads.

Package Style (Meter): FLANGE MOUNT

Offers a secure mounting option for industrial applications.

Maximum Operating Temperature: 175 °C

Can withstand high temperatures, making it suitable for harsh environments.

Maximum Collector-Emitter Voltage: 650 V

High voltage rating allows for handling high power levels.

Transistor Element Material: SILICON

Provides high reliability and performance in power applications.

Maximum Gate-Emitter Voltage: 20 V

Suitable for controlling the transistor efficiently within specified voltage limits.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures.

Maximum Collector Current (IC): 120 A

High current rating enables handling of large loads.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Specifies the minimum voltage required to turn the transistor on.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable and reliable terminal finish for long-term use.

Terminal Position: SINGLE

Simplifies installation and connection in a single terminal configuration.

Case Connection: COLLECTOR

Clearly defines the terminal connection for proper circuit design.

Nominal Turn On Time (ton): 36.8 ns

Fast turn-on time improves switching speed and efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH60T65SQD-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

126.2 ns

Nominal Turn On Time (ton):

36.8 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FGH60T65SQD-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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