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APT100GN60LDQ4G

Microchip Technology

APT100GN60LDQ4G by Microchip Technology

Microchip Technology's APT100GN60LDQ4G is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 229A max collector current. Ideal for power control applications, it features a built-in diode, 96ns turn-on time, and 435ns turn-off time. Suitable for high-power systems requiring up to 625W dissipation in a flange mount package.

Median Price

$14.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 7,302 parts In-Stock

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$14.950

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$12.910

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$11.840

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$11.460

7,302

$14.950

$12.910

$11.840

$11.460

DigiKey

USA . 21 parts In-Stock

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$14.950

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$12.137

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21

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Nova Conductors

Japan . 63 parts In-Stock

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$13.207

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Vyrian

USA . 8,678 parts In-Stock

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VNN

France . 942 parts In-Stock

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AZTECH Wire

Italy . 733 parts In-Stock

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$6.522

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$6.522

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$12.710

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90

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Continental Prestige Electronics

USA . 3,167 parts In-Stock

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$13.207

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$12.943

3,167

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$12.943

Netroflash

USA . 500 parts In-Stock

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$13.207

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Microchip USA

USA . 7,831 parts In-Stock

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$41.860

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Argo Parts USA

USA . 2,611 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,151 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of the APT100GN60LDQ4G by Microchip Technology, a top-of-the-line Insulated Gate Bipolar Transistor designed for optimal performance in power control applications. With Microchip's reputation for high-quality components, this N-CHANNEL transistor offers unparalleled reliability and efficiency. Whether you're looking to improve your power management system or enhance your industrial equipment, this transistor with built-in diode delivers exceptional value and performance. Trust Microchip Technology to provide you with the tools you need to succeed in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-channel types, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for freewheeling of inductive loads and protects the IGBT from voltage spikes, improving efficiency and reliability in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications where high power dissipation and switching speeds are required.

Terminal Form: THROUGH-HOLE

Through-hole terminals are easy to solder onto a circuit board, providing a secure and reliable connection for the IGBT.

Maximum Power Dissipation (Abs): 625 W

Capable of handling high power dissipation, allowing for use in demanding applications without the risk of overheating.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, this IGBT can handle high voltage applications with ease.

Maximum Gate-Emitter Voltage: 30 V

The maximum gate-emitter voltage ensures safe operation and protection of the IGBT during switching.

Maximum Collector Current (IC): 229 A

High maximum collector current rating allows for handling of high current loads, making it suitable for power control applications.

Nominal Turn On Time (ton): 96 ns

Fast turn-on time allows for quick switching speeds, essential in power control applications where precise timing is required.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT100GN60LDQ4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-264AA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

435 ns

Nominal Turn On Time (ton):

96 ns

Trade Compliance

APT100GN60LDQ4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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