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APT100GT120JU2

Microchip Technology

APT100GT120JU2 by Microchip Technology

Microchip Technology's APT100GT120JU2 is an N-CHANNEL IGBT with a max VCEsat of 2.1V and IC of 140A, ideal for power control applications. Featuring a built-in diode, it has a max VCE of 1200V and can handle up to 480W power dissipation. With fast turn-on/off times (ton: 335ns, toff: 610ns), this rectangular package transistor operates at temperatures up to 150°C.

Median Price

$33.525

Lifecycle Status

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4

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< 1k

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DigiKey

USA . 168 parts In-Stock

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$33.520

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Mouser Electronics

USA . 22 parts In-Stock

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$33.530

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22

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Nova Conductors

Japan . 17 parts In-Stock

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$32.340

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Vyrian

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Aztec Data Supply Inc.

USA . 820 parts In-Stock

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$0.690

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820

$0.690

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AZTECH Wire

Italy . 601 parts In-Stock

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Netroflash

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$32.340

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$30.723

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$30.076

100

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$30.723

$30.076

Corohmni

South Africa . 18 parts In-Stock

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$32.720

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Semicontronic

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Microchip USA

USA . 6,929 parts In-Stock

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$88.182

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RGB Technical Solutions

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Argo Parts USA

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Overview

Experience the power of the APT100GT120JU2 by Microchip Technology, a high-quality Insulated Gate Bipolar Transistor that is perfect for power control applications. With its N-CHANNEL polarity and single configuration with a built-in diode, this transistor offers reliability and efficiency. Its maximum collector-emitter voltage of 1200V and maximum collector current of 140A ensure optimal performance. The APT100GT120JU2 is ideal for a wide range of industrial applications, providing customers with exceptional value and benefits. Trust Microchip Technology for top-notch products that deliver results.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Makes it suitable for high power applications requiring N-channel transistors for efficient performance.

Configuration:

SINGLE WITH BUILT-IN DIODE - Provides convenience as the diode is already integrated, saving space and simplifying circuit design.

Transistor Application:

POWER CONTROL - Ideal for applications requiring precise control over power output.

Maximum VCEsat:

2.1 V - Low saturation voltage ensures minimal power loss and efficient operation.

Package Shape:

RECTANGULAR - Offers a sturdy and compact design for easy installation and integration.

Nominal Turn Off Time (toff):

610 ns - Fast turn-off time allows for quick response in switching applications.

No. of Terminals:

4 - Sufficient terminals for connecting to external components and devices.

Maximum Power Dissipation (Abs):

480 W - Capable of handling high power levels without overheating or risking damage.

Package Style (Meter):

FLANGE MOUNT - Enables secure mounting and heat dissipation in various applications.

Maximum Operating Temperature:

150 °C - Can operate in high-temperature environments without compromising performance.

Maximum Collector-Emitter Voltage:

1200 V - Can handle high voltages, making it suitable for demanding applications.

Transistor Element Material:

SILICON - Silicon material provides high reliability and performance in various conditions.

Maximum Gate-Emitter Voltage:

20 V - Ensures stable performance and protection against voltage spikes.

Maximum Collector Current (IC):

140 A - Capable of handling high currents for powering demanding loads.

Terminal Position:

UPPER - Convenient terminal placement for easy connections and wiring.

Case Connection:

ISOLATED - Ensures electrical insulation and protection for reliable operation.

Nominal Turn On Time (ton):

335 ns - Fast turn-on time for quick activation and response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT100GT120JU2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Additional Features:

AVALANCHE RATED, LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

335 ns

Maximum VCEsat:

2.1 V

Trade Compliance

APT100GT120JU2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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