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FD200R12KE3

Infineon Technologies

FD200R12KE3 by Infineon Technologies

Infineon's FD200R12KE3 is an N-CHANNEL IGBT with VCEsat of 2.15V and IC of 295A. Ideal for high-power applications, it offers a max VCE of 1200V and Pdiss of 1040W. Its fast turn-off time (toff) of 830ns makes it suitable for industrial power systems requiring efficient switching capabilities.

Median Price

$107.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 91 parts In-Stock

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$107.410

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91

$107.410

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Distributors (In-Stock)

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Digiode

USA . 400 parts In-Stock

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$104.148

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400

$104.148

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Vyrian

USA . 482 parts In-Stock

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$109.630

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482

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$147.000

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1

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 24,610 parts In-Stock

1+ parts

$1.946

100+ parts

$1.868

1k+ parts

$1.790

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$1.946

$1.868

$1.790

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Native Components

USA . 558 parts In-Stock

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$88.680

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$85.133

558

$88.680

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$85.133

Northwest PG Solutions

USA . 1,467 parts In-Stock

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$97.548

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1,467

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Corphita

USA . 202 parts In-Stock

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$98.667

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202

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Perfect Parts

USA . 2,892 parts In-Stock

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Infinite Electronics LLP (Excess)

. 167 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the FD200R12KE3 by Infineon Technologies. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, making it a top choice for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 295A, this N-CHANNEL transistor provides exceptional performance in a compact package. Trust Infineon Technologies to deliver superior products that exceed expectations and bring value to your projects. Elevate your designs with the FD200R12KE3 and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer higher efficiency and lower conduction losses compared to P-CHANNEL IGBTs, making them a better choice for many applications.

Maximum VCEsat: 2.15 V

The low VCEsat value indicates that this IGBT has low saturation voltage, resulting in reduced power dissipation and improved efficiency.

Nominal Turn Off Time (toff): 830 ns

The fast turn off time enables quick switching and reduces switching losses, making this IGBT suitable for high-frequency applications.

Maximum Power Dissipation (Abs): 1040 W

With a high maximum power dissipation value, this IGBT can handle high power levels without overheating, ensuring reliability in demanding conditions.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating allows this IGBT to be used in applications requiring high voltage handling capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD200R12KE3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FD200R12KE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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