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HGTG10N120BND

Onsemi

HGTG10N120BND by Onsemi

HGTG10N120BND by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage and 35A max collector current. Ideal for motor control applications, it features a single configuration with built-in diode and a nominal turn off time of 330ns. Package style: Flange mount, terminal finish: Matte Tin, operating temp: 150°C.

Median Price

$3.486

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 665 parts In-Stock

1+ parts

$4.810

100+ parts

$2.430

1k+ parts

$2.160

10k+ parts

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665

$4.810

$2.430

$2.160

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DigiKey

USA . 2,636 parts In-Stock

1+ parts

$5.030

100+ parts

$2.811

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$1.965

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$1.843

2,636

$5.030

$2.811

$1.965

$1.843

Rochester

USA . 22,081 parts In-Stock

1+ parts

-

100+ parts

$1.940

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$1.730

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$1.630

22,081

-

$1.940

$1.730

$1.630

Verical

USA . 21,100 parts In-Stock

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$2.163

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$2.038

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$2.038

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$2.040

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450

$2.040

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Digiode

USA . 979 parts In-Stock

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$2.042

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979

$2.042

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Chip Stock

USA . 15,500 parts In-Stock

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Vyrian

USA . 3,157 parts In-Stock

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Inventory MP

USA . 23 parts In-Stock

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Bristol Electronics

USA . 23 parts In-Stock

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LWI Electronics Inc

India . 9 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.657

100+ parts

$0.598

1k+ parts

$0.539

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500

$0.657

$0.598

$0.539

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Aztec Data Supply Inc.

USA . 215 parts In-Stock

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$1.127

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215

$1.127

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Semicontronic

India . 3,073 parts In-Stock

1+ parts

$1.830

100+ parts

$1.784

1k+ parts

$1.775

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3,073

$1.830

$1.784

$1.775

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Corphita

USA . 191 parts In-Stock

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$1.935

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191

$1.935

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Corohmni

South Africa . 173 parts In-Stock

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$1.959

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173

$1.959

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Argo Parts USA

USA . 2,404 parts In-Stock

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$2.040

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$2.040

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Continental Prestige Electronics

USA . 1,971 parts In-Stock

1+ parts

$2.040

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$1.999

1,971

$2.040

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$1.999

Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,004 parts In-Stock

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RC Electronics

USA . 17,723 parts In-Stock

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$2.250

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$2.120

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$2.080

17,723

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$2.080

Kulean Microsystems

USA . 8,353 parts In-Stock

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TANS Electronics

Latvia . 8,330 parts In-Stock

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SupplyDigital Components

Austria . 6,516 parts In-Stock

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Microchip USA

USA . 5,683 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 3,500 parts In-Stock

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Supply Digital

USA . 2,329 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,965 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,310 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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UHIMA Technologies

Türkiye . 484 parts In-Stock

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Authorized Procurement Solutions

USA . 386 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.999

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$1.938

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$1.897

50

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$1.897

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USA . 20 parts In-Stock

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Assy Fe

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Overview

Enhance your motor control systems with the high-quality HGTG10N120BND IGBT by Onsemi. With a single configuration and built-in diode, this N-channel transistor offers reliable performance in a range of applications. From efficient power conversion to precise speed control, this IGBT delivers superior functionality and durability. Trust Onsemi's reputation for excellence and choose the HGTG10N120BND for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and helps with heat dissipation, making the product suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and higher switching speed compared to P-channel IGBTs, making them more efficient for motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in minimizing reverse recovery losses and simplifies circuit design, making the product more cost-effective and efficient.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and reliability in this specific usage scenario.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and mounting, making it easy to integrate into motor control systems.

Nominal Turn Off Time (toff): 330 ns

The fast turn-off time ensures quick switching speed and reduces switching losses, improving overall efficiency in motor control applications.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating allows for operation in high voltage environments without risk of damage, enhancing the product's reliability.

Maximum Collector Current (IC): 35 A

The high collector current rating enables the IGBT to handle high current loads, making it suitable for motor control applications that require high power handling capabilities.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the IGBT to operate in harsh environments without overheating, ensuring long-term reliability and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTG10N120BND attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

330 ns

Nominal Turn On Time (ton):

32 ns

Trade Compliance

HGTG10N120BND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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