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FP20R06W1E3_B11

Infineon Technologies

FP20R06W1E3_B11 by Infineon Technologies

FP20R06W1E3_B11 by Infineon is an N-CHANNEL IGBT with 600V VCEsat, 27A IC, and 94W power dissipation. It is used for POWER CONTROL applications due to its fast turn-off time of 250ns. The transistor has a max operating temperature of 175°C and UL RECOGNIZED reference standard.

Median Price

$35.370

Lifecycle Status

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4

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< 1k

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Mouser Electronics

USA . 11 parts In-Stock

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$35.370

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$25.560

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Digiode

USA . 139 parts In-Stock

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$39.396

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Vyrian

USA . 672 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Modulus Dynamics

Lithuania . 255 parts In-Stock

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$0.611

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$0.587

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$0.562

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$0.611

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Corohmni

South Africa . 12 parts In-Stock

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$1.934

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AZTECH Wire

Italy . 188 parts In-Stock

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$8.347

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Semicontronic

India . 22 parts In-Stock

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$29.520

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$28.782

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$28.634

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$28.634

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Ampacity Inc.

Singapore . 8 parts In-Stock

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$29.520

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Corphita

USA . 638 parts In-Stock

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$37.323

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Lixinc

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 200 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Experience the power and efficiency of the FP20R06W1E3_B11 from Infineon Technologies, a leading manufacturer in insulated gate bipolar transistors. This complex N-channel transistor is perfect for power control applications, offering a maximum VCEsat of 2V and a maximum collector-emitter voltage of 600V. With its fast turn-off time and high power dissipation capabilities, this transistor ensures optimal performance in demanding environments. Trust in the quality and reliability of Infineon Technologies to deliver exceptional products that meet your needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity allows for efficient power control and high performance in various applications.

Configuration: COMPLEX

COMPLEX configuration provides versatility and flexibility in power control operations.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in regulating power.

Maximum VCEsat: 2 V

Low VCEsat value ensures minimal power loss and high efficiency during operation.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration in various electronic systems.

Nominal Turn Off Time (toff): 250 ns

Fast turn off time enables quick response and precise control during power switching transitions.

No. of Terminals: 23

Multiple terminals provide a range of connection options for different circuit configurations.

Maximum Power Dissipation (Abs): 94 W

High power dissipation capability ensures reliable performance under heavy load conditions.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for use in various environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating ensures robustness and durability in power applications.

Transistor Element Material: SILICON

Silicon material offers high thermal conductivity and reliability for consistent performance.

Maximum Gate-Emitter Voltage: 20 V

Wide gate-emitter voltage range provides flexibility in gate control and drive capabilities.

Maximum Collector Current (IC): 27 A

High collector current rating allows for handling of large currents in power circuits.

Terminal Position: UPPER

Upper terminal position facilitates easy connection and integration in electronic systems.

Case Connection: ISOLATED

Isolated case connection helps in reducing interference and enhancing safety in circuit design.

Nominal Turn On Time (ton): 37 ns

Fast turn on time ensures quick response and precise control during power switching operations.

Reference Standard: UL RECOGNIZED

UL recognized standard ensures compliance with safety and quality requirements for electronic components.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP20R06W1E3_B11 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

250 ns

Nominal Turn On Time (ton):

37 ns

Maximum VCEsat:

2 V

Trade Compliance

FP20R06W1E3_B11 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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