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AFGHL40T120RHD

Onsemi

AFGHL40T120RHD by Onsemi

AFGHL40T120RHD by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.4V and IC of 48A, ideal for POWER CONTROL applications. It has a max VCE of 1200V, operating temperature range from -55 to 175 °C, and turn-off time of 230ns. The package style is FLANGE MOUNT with through-hole terminals in a RECTANGULAR shape.

Median Price

$8.509

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$7.580

1k+ parts

$6.780

10k+ parts

$6.380

900

-

$7.580

$6.780

$6.380

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$9.438

1k+ parts

$8.950

10k+ parts

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900

-

$9.438

$8.950

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Distributors (In-Stock)

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Maritex

Poland . 450 parts In-Stock

1+ parts

$4.441

100+ parts

$2.680

1k+ parts

$2.263

10k+ parts

-

450

$4.441

$2.680

$2.263

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Digiode

USA . 1,454 parts In-Stock

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$7.999

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1,454

$7.999

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Vyrian

USA . 8,184 parts In-Stock

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Flip Electronics

USA . 900 parts In-Stock

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900

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Distributors (Availability)

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Native Components

USA . 61 parts In-Stock

1+ parts

$0.299

100+ parts

-

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$0.287

61

$0.299

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-

$0.287

Northwest PG Solutions

USA . 1,050 parts In-Stock

1+ parts

$0.329

100+ parts

-

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$0.290

1,050

$0.329

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$0.290

Corphita

USA . 407 parts In-Stock

1+ parts

$7.578

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-

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407

$7.578

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Corohmni

South Africa . 114 parts In-Stock

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$8.420

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114

$8.420

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AZTECH Wire

Italy . 902 parts In-Stock

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$22.140

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902

$22.140

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Component Stockers USA

USA . 329 parts In-Stock

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$99.990

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329

$99.990

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TANS Electronics

Latvia . 4,697 parts In-Stock

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Kulean Microsystems

USA . 3,307 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,520 parts In-Stock

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GreenTree Electronics

Israel . 2,250 parts In-Stock

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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Problanco Electronics

Mexico . 613 parts In-Stock

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SupplyDigital Components

Austria . 117 parts In-Stock

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Overview

Enhance your power control applications with the AFGHL40T120RHD by Onsemi, a high-quality Insulated Gate Bipolar Transistor with a single configuration and built-in diode. Designed for optimal performance, this transistor offers a maximum VCEsat of 2.4V and a maximum collector-emitter voltage of 1200V, ensuring efficient power dissipation of up to 400W. With a fast turn-off time of 230ns and a turn-on time of 66ns, this transistor is perfect for various industrial applications. Trust in Onsemi's reputation for reliability and innovation, and experience the value and benefits that the AFGHL40T120RHD has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this IGBT lightweight and durable, ideal for applications where weight and portability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making this product a good choice for power control applications where energy efficiency is a priority.

Maximum VCEsat: 2.4 V

The low VCEsat value of 2.4V indicates that this IGBT has low saturation voltage, leading to reduced power dissipation and heat generation, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 400 W

With a maximum power dissipation of 400W, this IGBT can handle high power levels efficiently, ensuring reliable operation in demanding power control applications.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating of 1200V enables this IGBT to withstand high voltage spikes and surges, making it suitable for power control applications where voltage regulation is critical.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL40T120RHD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7.3 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

230 ns

Nominal Turn On Time (ton):

66 ns

Maximum VCEsat:

2.4 V

Trade Compliance

AFGHL40T120RHD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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