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AFGHL25T120RLD

Onsemi

AFGHL25T120RLD by Onsemi

AFGHL25T120RLD by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 48A IC, and 400W Pd. Ideal for power control applications, it features a single configuration with built-in diode and operates b/w -55 to 175 °C.

Median Price

$4.355

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 27 parts In-Stock

1+ parts

$5.950

100+ parts

$4.050

1k+ parts

$3.070

10k+ parts

$2.770

27

$5.950

$4.050

$3.070

$2.770

Rochester

USA . 7,200 parts In-Stock

1+ parts

-

100+ parts

$2.760

1k+ parts

$2.470

10k+ parts

$2.330

7,200

-

$2.760

$2.470

$2.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 894 parts In-Stock

1+ parts

$2.936

100+ parts

-

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-

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-

894

$2.936

-

-

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Vyrian

USA . 8,985 parts In-Stock

1+ parts

-

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8,985

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,447 parts In-Stock

1+ parts

$2.781

100+ parts

-

1k+ parts

-

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-

1,447

$2.781

-

-

-

Corohmni

South Africa . 340 parts In-Stock

1+ parts

$3.090

100+ parts

-

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-

10k+ parts

-

340

$3.090

-

-

-

Native Components

USA . 337 parts In-Stock

1+ parts

$7.000

100+ parts

-

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-

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-

337

$7.000

-

-

-

SupplyDigital Components

Austria . 8,380 parts In-Stock

1+ parts

-

100+ parts

-

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8,380

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TANS Electronics

Latvia . 7,177 parts In-Stock

1+ parts

-

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7,177

-

-

-

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Kulean Microsystems

USA . 4,927 parts In-Stock

1+ parts

-

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4,927

-

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Problanco Electronics

Mexico . 4,056 parts In-Stock

1+ parts

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4,056

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-

-

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Northwest PG Solutions

USA . 1,935 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$6.860

10k+ parts

-

1,935

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-

$6.860

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UHIMA Technologies

Türkiye . 369 parts In-Stock

1+ parts

-

100+ parts

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369

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Overview

Elevate your power control applications with the AFGHL25T120RLD from Onsemi. Manufactured with precision and expertise, this insulated gate bipolar transistor (IGBT) offers unparalleled performance and reliability. Designed with a single configuration and built-in diode, this product is perfect for a wide range of power control applications. With a maximum collector-emitter voltage of 1200V and maximum power dissipation of 400W, the AFGHL25T120RLD ensures optimal efficiency and durability. Trust Onsemi to deliver high-quality components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the product durable and reliable for long-term use.

Maximum VCEsat: 2 V

Low VCEsat minimizes power loss and improves efficiency of power control applications.

Nominal Turn Off Time (toff): 205 ns

Fast turn off time allows for quick response and precise power control in the circuit.

Maximum Power Dissipation (Abs): 400 W

High power dissipation capability enables the transistor to handle heavy loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows the transistor to function effectively in various environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating makes this transistor suitable for high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

The gate-emitter voltage limit ensures safe operation and protection of the transistor.

Maximum Collector Current (IC): 48 A

High collector current rating allows the transistor to handle large currents in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL25T120RLD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7.1 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

205 ns

Nominal Turn On Time (ton):

43.2 ns

Maximum VCEsat:

2 V

Trade Compliance

AFGHL25T120RLD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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