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IKW75N60TXK

Infineon Technologies

IKW75N60TXK by Infineon Technologies

IKW75N60TXK by Infineon Technologies is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 80A max collector current. It has a single configuration with built-in diode, ideal for power control applications. The transistor offers fast switching with 69ns turn-on time and 401ns turn-off time at a max operating temperature of 150°C.

Median Price

$5.666

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$5.666

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50

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Digiode

USA . 446 parts In-Stock

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446

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Vyrian

USA . 244 parts In-Stock

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244

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Bristol Electronics

USA . 44 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 125 parts In-Stock

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$0.584

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$0.584

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Modulus Dynamics

Lithuania . 13,415 parts In-Stock

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$0.619

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$0.594

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$0.569

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13,415

$0.619

$0.594

$0.569

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Aztec Data Supply Inc.

USA . 3,871 parts In-Stock

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$1.380

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Aranea Global

USA . 2,000 parts In-Stock

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$5.552

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$5.330

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$5.552

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Continental Prestige Electronics

USA . 4,216 parts In-Stock

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$5.666

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$5.552

4,216

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Semicontronic

India . 1,470 parts In-Stock

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$11.050

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$10.774

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$10.718

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AZTECH Wire

Italy . 471 parts In-Stock

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$12.307

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Ampacity Inc.

Singapore . 966 parts In-Stock

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$42.050

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Microchip USA

USA . 1,764 parts In-Stock

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Corphita

USA . 636 parts In-Stock

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Argo Parts USA

USA . 430 parts In-Stock

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Overview

Discover the power of Infineon Technologies with the IKW75N60TXK insulated gate bipolar transistor. Designed for power control applications, this N-channel transistor offers unparalleled performance and reliability. With a maximum collector-emitter voltage of 600V and a maximum collector current of 80A, this single configuration transistor provides efficient power management in a compact package. Trust Infineon's expertise in semiconductor technology to deliver quality components that exceed expectations. Experience seamless integration and superior functionality with the IKW75N60TXK - the ultimate solution for your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IGBT, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speeds, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient circuit design, reducing external component count.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, providing reliable and efficient performance.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring stability during operation.

Nominal Turn Off Time (toff): 401 ns

Fast turn-off time allows for precise control of power output, enhancing overall system performance.

No. of Terminals: 3

Simple three-terminal design simplifies circuit connections and reduces complexity in circuit layout.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy and secure mounting options for various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, making it suitable for power control applications with varying voltage requirements.

Transistor Element Material: SILICON

Silicon material ensures high efficiency and reliability in power switching applications.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling of large currents, making it suitable for high-power applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection to the circuit, reducing assembly time.

Case Connection: COLLECTOR

Collector case connection ensures efficient heat dissipation, enhancing overall thermal performance of the IGBT.

Nominal Turn On Time (ton): 69 ns

Fast turn-on time enables quick response in power control applications, improving system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW75N60TXK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

HIGH SWITCHING SPEED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

401 ns

Nominal Turn On Time (ton):

69 ns

Trade Compliance

IKW75N60TXK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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