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IKW75N65EH5

Infineon Technologies

IKW75N65EH5 by Infineon Technologies

IKW75N65EH5 by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a max IC of 90A. It is designed for power control applications, featuring a package style of FLANGE MOUNT and a max operating temperature of 175°C.

Median Price

$6.769

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 320 parts In-Stock

1+ parts

$7.090

100+ parts

$4.260

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$4.020

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320

$7.090

$4.260

$4.020

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Verical

USA . 240 parts In-Stock

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$6.448

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240

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$6.448

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Distributors (In-Stock)

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Vyrian

USA . 354 parts In-Stock

1+ parts

$5.882

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354

$5.882

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Digiode

USA . 975 parts In-Stock

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975

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Rutronik

Germany . 15 parts In-Stock

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$4.020

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$3.720

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15

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$4.020

$3.720

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Semtec, LLC

USA . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,685 parts In-Stock

1+ parts

$1.653

100+ parts

$1.587

1k+ parts

$1.521

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3,685

$1.653

$1.587

$1.521

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Ampacity Inc.

Singapore . 240 parts In-Stock

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$5.000

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240

$5.000

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CoreStaff

Japan . 240 parts In-Stock

1+ parts

$5.590

100+ parts

$4.060

1k+ parts

$3.950

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240

$5.590

$4.060

$3.950

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Authorized Procurement Solutions

USA . 26,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,993 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,995 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Corphita

USA . 425 parts In-Stock

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Kepictronics

USA . 155 parts In-Stock

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Overview

Enhance your power control applications with the top-tier quality and reliability of the Infineon Technologies IKW75N65EH5 Insulated Gate Bipolar Transistor. With a single configuration and built-in diode, this N-channel transistor offers exceptional performance and efficiency. Designed to handle high power dissipation and voltage requirements, this IGBT ensures optimal operation even in extreme temperatures. Trust in Infineon's renowned expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your power control systems today with the IKW75N65EH5 for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Maximum VCEsat: 2.1 V

Low saturation voltage allows for efficient power control and reduces energy loss in the system.

Nominal Turn Off Time (toff): 232 ns

Fast turn-off time allows for precise control and high switching speed in power applications.

Maximum Power Dissipation (Abs): 395 W

High power dissipation capability makes it suitable for handling large loads and high power applications.

Maximum Collector-Emitter Voltage: 650 V

High voltage rating allows for use in a wide range of applications, including high power systems.

Maximum Collector Current (IC): 90 A

High current rating enables the transistor to handle heavy loads and high-power circuits.

Nominal Turn On Time (ton): 61 ns

Fast turn-on time ensures quick response and efficient operation of the transistor in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW75N65EH5 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

4.8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

232 ns

Nominal Turn On Time (ton):

61 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IKW75N65EH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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