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IKW75N65EL5

Infineon Technologies

IKW75N65EL5 by Infineon Technologies

IKW75N65EL5 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 650V and a max collector current of 80A. It has a nominal turn-off time of 474ns and a turn-on time of 53ns, making it ideal for power control applications requiring fast switching speeds. The transistor comes in a rectangular package style with through-hole terminals, suitable for flange mount installations.

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5

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1k+

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Nova Conductors

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Digiode

USA . 496 parts In-Stock

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AGACORP

USA . 480 parts In-Stock

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480

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Vyrian

USA . 265 parts In-Stock

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265

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Modulus Dynamics

Lithuania . 9,739 parts In-Stock

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$1.716

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$1.647

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$1.579

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$1.716

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AZTECH Wire

Italy . 336 parts In-Stock

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$5.288

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Semicontronic

India . 1,227 parts In-Stock

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$19.050

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$18.574

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$18.478

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Ampacity Inc.

Singapore . 598 parts In-Stock

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$33.050

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Metaverse IC Inc.

Canada . 100,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,558 parts In-Stock

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Continental Prestige Electronics

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Alle Elektronik GmbH

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Argo Parts USA

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Futuretech Components

Singapore . 3,818 parts In-Stock

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Perfect Parts

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Lixinc

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Corphita

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GreenTree Electronics

Israel . 480 parts In-Stock

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Aranea Global

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Overview

Experience the power of Infineon Technologies with the IKW75N65EL5 Insulated Gate Bipolar Transistor. Built with precision and quality in mind, this N-CHANNEL transistor offers unparalleled performance in power control applications. With a maximum collector-emitter voltage of 650V and a nominal turn on time of just 53ns, this single configuration transistor provides reliability and efficiency like no other. Trust in Infineon Technologies to deliver cutting-edge solutions for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances the durability and reliability of the IGBT, making it a good choice for long-term usage.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high performance and efficiency, making this product suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and implementation, saving time and effort for the user.

Transistor Application: POWER CONTROL

This IGBT is specifically designed for power control applications, ensuring optimal performance and reliability in such scenarios.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and integration into existing systems.

Nominal Turn Off Time (toff): 474 ns

The low turn off time of 474 ns indicates fast switching speed, enabling efficient power control and management.

No. of Terminals: 3

Having 3 terminals allows for easier connection and integration into circuitry, reducing complexity and potential errors.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating of 650 V ensures compatibility with a wide range of power supply systems.

Transistor Element Material: SILICON

Silicon is a reliable and widely used material for transistor elements, ensuring high performance and durability.

Maximum Collector Current (IC): 80 A

With a maximum collector current rating of 80 A, this IGBT can handle high power levels, making it suitable for demanding applications.

Terminal Finish: TIN

The terminal finish of tin provides good conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and wiring, enhancing the user-friendliness of the product.

Nominal Turn On Time (ton): 53 ns

The low turn on time of 53 ns indicates fast switching speed, enabling quick response and control in power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW75N65EL5 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

474 ns

Nominal Turn On Time (ton):

53 ns

Trade Compliance

IKW75N65EL5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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