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IRG4BC30FD1PBF

Infineon Technologies

IRG4BC30FD1PBF by Infineon Technologies

IRG4BC30FD1PBF by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 31A max collector current. It has a 740ns turn off time, ideal for power control applications. The transistor comes in a rectangular package with through-hole terminals and can handle up to 100W of power dissipation at a max operating temperature of 150°C.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,686 parts In-Stock

1+ parts

-

100+ parts

$1.650

1k+ parts

$1.480

10k+ parts

$1.390

3,686

-

$1.650

$1.480

$1.390

Verical

USA . 2,936 parts In-Stock

1+ parts

-

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$1.850

10k+ parts

$1.738

2,936

-

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$1.738

DigiKey

USA . 750 parts In-Stock

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$2.170

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750

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$2.170

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Distributors (In-Stock)

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Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$1.695

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76

$1.695

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Digiode

USA . 291 parts In-Stock

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$1.738

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291

$1.738

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Vyrian

USA . 1,970 parts In-Stock

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1,970

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 16,549 parts In-Stock

1+ parts

$0.779

100+ parts

$0.748

1k+ parts

$0.717

10k+ parts

-

16,549

$0.779

$0.748

$0.717

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Ampacity Inc.

Singapore . 1,551 parts In-Stock

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$1.560

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1,551

$1.560

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Corphita

USA . 811 parts In-Stock

1+ parts

$1.647

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811

$1.647

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Argo Parts USA

USA . 3,143 parts In-Stock

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$1.695

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3,143

$1.695

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Continental Prestige Electronics

USA . 1,627 parts In-Stock

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$1.695

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$1.661

1,627

$1.695

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$1.661

Netroflash

USA . 500 parts In-Stock

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$1.695

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500

$1.695

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Component Stockers USA

USA . 144 parts In-Stock

1+ parts

$1.890

100+ parts

$1.770

1k+ parts

$1.610

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144

$1.890

$1.770

$1.610

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QUARKTWIN TECHNOLOGY LTD

USA . 26,360 parts In-Stock

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Microchip USA

USA . 7,333 parts In-Stock

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Perfect Parts

USA . 1,064 parts In-Stock

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1,064

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Overview

Upgrade your power control systems with the IRG4BC30FD1PBF Insulated Gate Bipolar Transistor by Infineon Technologies. Known for their top-quality products, Infineon offers a single N-channel IGBT with a built-in diode that ensures efficient performance and reliable power control. Ideal for applications requiring high power dissipation, this transistor boasts a maximum collector-emitter voltage of 600V and a maximum gate-emitter voltage of 20V. With a nominal turn-off time of 740ns and a nominal turn-on time of 46ns, this IGBT is perfect for a wide range of industrial and automotive applications. Trust Infineon to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, contributing to the overall reliability of the IGBT.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and low on-state voltage drop, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the IGBT package.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring high performance and reliability in managing power flow.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, making it suitable for applications requiring high power handling capabilities.

Maximum Gate-Emitter Voltage: 20 V

Provides a safe operating range for the gate control signal, preventing damage to the IGBT.

Maximum Collector Current (IC): 31 A

Capable of handling significant current levels, making it suitable for power control applications requiring high current flow.

Nominal Turn On Time (ton): 46 ns

Fast turn-on time ensures quick response and efficient power control in applications where timing is critical.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30FD1PBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

740 ns

Nominal Turn On Time (ton):

46 ns

Trade Compliance

IRG4BC30FD1PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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