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IKW30N60H3

Infineon Technologies

IKW30N60H3 by Infineon Technologies

IKW30N60H3 by Infineon is an N-CHANNEL IGBT with 600V VCE, 60A IC, and 262ns toff. Ideal for POWER CONTROL applications due to its SINGLE configuration with BUILT-IN DIODE. Operates at a max temp of 175°C in a RECTANGULAR package style.

Median Price

$3.410

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,794 parts In-Stock

1+ parts

$3.410

100+ parts

$1.700

1k+ parts

$1.420

10k+ parts

$1.240

5,794

$3.410

$1.700

$1.420

$1.240

Distributors (In-Stock)

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Maritex

Poland . 14 parts In-Stock

1+ parts

$1.966

100+ parts

$1.152

1k+ parts

$0.955

10k+ parts

-

14

$1.966

$1.152

$0.955

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Digiode

USA . 192 parts In-Stock

1+ parts

$2.916

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-

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192

$2.916

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Cyclops Electronics Ltd

UK . 9,600 parts In-Stock

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9,600

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Rutronik

Germany . 4,590 parts In-Stock

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$2.300

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$2.120

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4,590

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$2.300

$2.120

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Vyrian

USA . 2,920 parts In-Stock

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Infinite Electronics LLP

India . 2,880 parts In-Stock

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2,880

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

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300

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Nova Conductors

Japan . 79 parts In-Stock

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79

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Bristol Electronics

USA . 28 parts In-Stock

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-

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$2.464

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28

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$2.464

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 13,601 parts In-Stock

1+ parts

$1.169

100+ parts

$1.122

1k+ parts

$1.075

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-

13,601

$1.169

$1.122

$1.075

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Ampacity Inc.

Singapore . 3,004 parts In-Stock

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$2.610

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3,004

$2.610

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Semicontronic

India . 2,969 parts In-Stock

1+ parts

$2.610

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$2.545

1k+ parts

$2.532

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2,969

$2.610

$2.545

$2.532

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Corphita

USA . 836 parts In-Stock

1+ parts

$2.763

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836

$2.763

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Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$58.160

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$40.712

10k+ parts

$40.712

1,000

$58.160

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$40.712

$40.712

Perfect Parts

USA . 26,168 parts In-Stock

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26,168

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Infinite Electronics LLP (Excess)

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A-Z Elektronik GmbH

Germany . 7,478 parts In-Stock

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Continental Prestige Electronics

USA . 3,536 parts In-Stock

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3,536

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S.R.D Solutions

India . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,409 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,085 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 1,000 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Lixinc

USA . 63 parts In-Stock

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Overview

Infineon High Speed Trench & Fieldstop IGBTs use TrenchStop™ and Fieldstop technology to provide superb switching performance, very low VCEsat, and low EMI. Infineon High Speed Trench & Fieldstop IGBTs are ideal for uninterruptible power supplies applications. The IGW25N120H3 IGBT is recommended in combination with SiC Diode IDH15S120 and is also used for solar inverter applications. The IKW15N120H3, IKW30N60H3, and IKW20N60H3 IGBTs are each part of a high speed DuoPack and come with a very soft, fast recovery anti-parallel diode.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state resistance and higher efficiency compared to P-Channel IGBTs, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow, enhancing the overall performance of the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in controlling high power loads.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation, making it convenient for various electronic applications.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, the IGBT can handle high voltage applications with ease, ensuring safety and reliability.

Maximum Collector Current (IC): 60 A

The high collector current rating allows the IGBT to handle high current loads, making it suitable for power control applications.

Nominal Turn On Time (ton): 50 ns

Fast turn-on time ensures quick response and efficient switching, making the IGBT ideal for high-speed power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW30N60H3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

262 ns

Nominal Turn On Time (ton):

50 ns

Trade Compliance

IKW30N60H3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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