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IKW30N60TA

Infineon Technologies

IKW30N60TA by Infineon Technologies

IKW30N60TA by Infineon is an N-CHANNEL IGBT with VCEsat of 2.05V and IC of 60A. Ideal for POWER CONTROL applications, it has a toff of 382ns, ton of 50ns, and can handle up to 600V at 175°C.

Median Price

$4.120

Lifecycle Status

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3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

USA . 936 parts In-Stock

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Digiode

USA . 603 parts In-Stock

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Modulus Dynamics

Lithuania . 8,047 parts In-Stock

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$0.473

100+ parts

$0.454

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$0.435

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8,047

$0.473

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Corohmni

South Africa . 884 parts In-Stock

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$1.394

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Aranea Global

USA . 500 parts In-Stock

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$4.038

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$3.876

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$4.038

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Continental Prestige Electronics

USA . 5,747 parts In-Stock

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$4.038

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Argo Parts USA

USA . 4,018 parts In-Stock

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AZTECH Wire

Italy . 328 parts In-Stock

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$4.942

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Semicontronic

India . 1,591 parts In-Stock

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$57.050

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$55.624

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$55.338

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Ampacity Inc.

Singapore . 541 parts In-Stock

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$64.050

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Corphita

USA . 243 parts In-Stock

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Authorized Procurement Solutions

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Overview

Power up your projects with the IKW30N60TA by Infineon Technologies! This Insulated Gate Bipolar Transistor (IGBT) boasts top-notch quality and reliability, making it the perfect choice for power control applications. With a maximum collector-emitter voltage of 600V and a maximum collector current of 60A, this transistor delivers exceptional performance. Whether you're working on industrial machinery or renewable energy systems, the IKW30N60TA offers unparalleled value and efficiency. Trust Infineon Technologies for all your IGBT needs and experience the difference in power and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, enhancing durability and reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and better control over the power handling capabilities of the transistor.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance in high-power circuits.

Maximum VCEsat: 2.05 V

Low collector-emitter saturation voltage helps minimize power losses and improves efficiency.

Nominal Turn Off Time (toff): 382 ns

Quick turn-off time allows for fast switching speeds and precise control in power control applications.

Maximum Power Dissipation (Abs): 187 W

High power dissipation capability enables handling of heavy loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures stability and performance even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating makes it suitable for high-voltage applications.

Maximum Gate-Emitter Voltage: 20 V

Adequate gate-emitter voltage rating for reliable switching and control.

Maximum Collector Current (IC): 60 A

High collector current rating allows for handling of large currents without failure.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW30N60TA attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

382 ns

Nominal Turn On Time (ton):

50 ns

Maximum VCEsat:

2.05 V

Trade Compliance

IKW30N60TA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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