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FGH40T65SPD_F155

Onsemi

FGH40T65SPD_F155 by Onsemi

FGH40T65SPD_F155 by Onsemi is an N-CHANNEL IGBT with 650V VCE, 80A IC, and 267W Ptot. Ideal for power control applications, it features a built-in diode, 56ns toff, and operates up to 175°C.

Median Price

$2.415

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$2.700

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1

$2.700

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Rochester

USA . 1,211 parts In-Stock

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-

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$2.130

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$1.900

10k+ parts

$1.790

1,211

-

$2.130

$1.900

$1.790

Distributors (In-Stock)

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Digiode

USA . 461 parts In-Stock

1+ parts

$2.261

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461

$2.261

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Nova Conductors

Japan . 700 parts In-Stock

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$4.081

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$4.081

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Chip Stock

USA . 7,570 parts In-Stock

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7,570

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Martec Srl

Italy . 2,249 parts In-Stock

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Vyrian

USA . 1,358 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,901 parts In-Stock

1+ parts

$1.450

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$1.450

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Ampacity Inc.

Singapore . 837 parts In-Stock

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$2.020

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837

$2.020

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Corphita

USA . 2,395 parts In-Stock

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$2.142

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$2.142

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Corohmni

South Africa . 217 parts In-Stock

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$2.380

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$2.380

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Argo Parts USA

USA . 2,249 parts In-Stock

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$4.081

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2,249

$4.081

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Netroflash

USA . 1,000 parts In-Stock

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$4.081

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$3.877

10k+ parts

$3.795

1,000

$4.081

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$3.877

$3.795

Continental Prestige Electronics

USA . 821 parts In-Stock

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$4.081

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$3.999

821

$4.081

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$3.999

Microchip USA

USA . 306 parts In-Stock

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$18.499

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Problanco Electronics

Mexico . 5,348 parts In-Stock

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Kulean Microsystems

USA . 3,115 parts In-Stock

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TANS Electronics

Latvia . 1,271 parts In-Stock

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 1,182 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 567 parts In-Stock

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UHIMA Technologies

Türkiye . 359 parts In-Stock

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Overview

Experience the next level of power control with Onsemi's FGH40T65SPD_F155 Insulated Gate Bipolar Transistor. Designed with precision and quality in mind, this N-CHANNEL transistor offers a seamless single configuration with a built-in diode for enhanced performance. From industrial machinery to renewable energy systems, this transistor is the ultimate solution for high-power applications. With a maximum operating temperature of 175°C and a collector-emitter voltage of 650V, trust Onsemi to deliver reliability and efficiency in every use. Elevate your projects with the FGH40T65SPD_F155 and unleash the power of innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and durability, making it ideal for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower resistance and faster switching speeds, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from voltage spikes and reverse currents, adding an extra layer of safety.

Transistor Application: POWER CONTROL

This IGBT is designed specifically for power control applications, ensuring efficient and precise control of electrical power.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and placement within a circuit, simplifying the overall design process.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and reliable connection, making it easier to solder and install the IGBT securely.

Nominal Turn Off Time (toff): 56 ns

The fast turn-off time allows for quick and efficient switching, reducing power loss and improving overall performance.

No. of Terminals: 3

With 3 terminals, this IGBT is easy to connect and integrate into various circuit designs, offering flexibility and versatility.

Maximum Power Dissipation (Abs): 267 W

The high power dissipation rating ensures that this IGBT can handle heavy loads and high temperatures without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount design provides a secure and stable connection, ideal for applications where vibration or movement is a concern.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this IGBT can withstand demanding conditions and maintain stable performance.

Maximum Collector-Emitter Voltage: 650 V

The high voltage rating makes this IGBT suitable for high power applications, offering protection against voltage spikes and surges.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring high performance and durability.

Maximum Gate-Emitter Voltage: 20 V

The low gate-emitter voltage allows for efficient and precise control of the IGBT, enabling accurate power regulation.

Maximum Collector Current (IC): 80 A

With a high collector current rating, this IGBT can handle heavy loads and provide reliable power control in a variety of applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

The gate-emitter threshold voltage determines the turn-on voltage, ensuring the IGBT activates at the correct level for optimal performance.

Terminal Position: SINGLE

The single terminal position simplifies the wiring and connection process, making it easier to integrate this IGBT into a circuit.

Case Connection: COLLECTOR

The collector case connection offers a secure and reliable grounding point, ensuring stable performance and safe operation.

Nominal Turn On Time (ton): 63 ns

The fast turn-on time allows for quick activation and response, improving the efficiency and overall performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40T65SPD_F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

56 ns

Nominal Turn On Time (ton):

63 ns

Trade Compliance

FGH40T65SPD_F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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