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BSM50GD120DN2BOSA1

Infineon Technologies

BSM50GD120DN2BOSA1 by Infineon Technologies

Infineon's BSM50GD120DN2BOSA1 is a N-CHANNEL IGBT with 6 elements in a BRIDGE configuration. It has a max voltage of 1200V, max current of 72A, and turn off time of 450ns. Ideal for high-power applications like motor drives and inverters due to its fast switching capabilities.

Median Price

$217.436

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$159.853

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900

$159.853

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Galco

USA . 2 parts In-Stock

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$275.020

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2

$275.020

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Vyrian

USA . 6,496 parts In-Stock

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6,496

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VNN

France . 2,722 parts In-Stock

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2,722

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Digiode

USA . 296 parts In-Stock

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 229 parts In-Stock

1+ parts

$0.534

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229

$0.534

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Aztec Data Supply Inc.

USA . 313 parts In-Stock

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$0.910

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313

$0.910

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Modulus Dynamics

Lithuania . 1,899 parts In-Stock

1+ parts

$1.581

100+ parts

$1.518

1k+ parts

$1.455

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-

1,899

$1.581

$1.518

$1.455

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AZTECH Wire

Italy . 399 parts In-Stock

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$8.225

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399

$8.225

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Ampacity Inc.

Singapore . 630 parts In-Stock

1+ parts

$47.050

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630

$47.050

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Continental Prestige Electronics

USA . 3,229 parts In-Stock

1+ parts

$159.853

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$156.656

3,229

$159.853

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$156.656

Netroflash

USA . 100 parts In-Stock

1+ parts

$159.853

100+ parts

-

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$151.860

10k+ parts

$148.663

100

$159.853

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$151.860

$148.663

Microchip USA

USA . 4,943 parts In-Stock

1+ parts

$412.530

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4,943

$412.530

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Argo Parts USA

USA . 3,692 parts In-Stock

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3,692

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Corphita

USA . 327 parts In-Stock

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327

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Overview

Experience the next level of power and efficiency with the BSM50GD120DN2BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor comes in a bridge configuration with 6 elements and built-in diode, perfect for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 450ns, this product offers unmatched performance and reliability. Upgrade your systems today with the BSM50GD120DN2BOSA1 and see the difference it makes in your operations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL design allows for efficient switching and lower conduction losses, making this IGBT a suitable choice for high-power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

The bridge configuration with built-in diode simplifies circuit design and improves overall efficiency, making this IGBT ideal for motor control and power conversion applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can handle high voltage loads, providing reliable performance in demanding applications.

Maximum Collector Current (IC): 72 A

The high collector current rating allows this IGBT to handle large current loads, making it suitable for high-power industrial applications.

Nominal Turn On Time (ton): 100 ns

The fast turn-on time ensures quick response and efficient operation, making this IGBT a good choice for applications requiring rapid switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) BSM50GD120DN2BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X17

No. of Elements:

6

No. of Terminals:

17

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

450 ns

Nominal Turn On Time (ton):

100 ns

Trade Compliance

BSM50GD120DN2BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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