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FGD3050G2V

Onsemi

FGD3050G2V by Onsemi

FGD3050G2V by Onsemi is an N-CHANNEL IGBT with built-in TVS diode and resistor, ideal for automotive ignition applications. It features a max VCEsat of 1.2V, collector current of 32A, and operating temperature range from -40 to 175 °C. This surface-mount transistor has a package style of small outline and meets AEC-Q101 standards.

Median Price

$2.950

Lifecycle Status

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5

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1k+

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Mouser Electronics

USA . 1,208 parts In-Stock

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$2.950

100+ parts

$1.320

1k+ parts

$1.030

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1,208

$2.950

$1.320

$1.030

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DigiKey

USA . 1,189 parts In-Stock

1+ parts

$2.950

100+ parts

$1.319

1k+ parts

$0.985

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-

1,189

$2.950

$1.319

$0.985

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Digiode

USA . 2,050 parts In-Stock

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$2.261

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2,050

$2.261

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Vyrian

USA . 914 parts In-Stock

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$2.380

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914

$2.380

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 103 parts In-Stock

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$2.142

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103

$2.142

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Corohmni

South Africa . 272 parts In-Stock

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$2.380

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272

$2.380

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Native Components

USA . 253 parts In-Stock

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$5.155

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253

$5.155

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Microchip USA

USA . 9,074 parts In-Stock

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$6.898

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9,074

$6.898

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SupplyDigital Components

Austria . 7,645 parts In-Stock

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TANS Electronics

Latvia . 4,934 parts In-Stock

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2,685

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Northwest PG Solutions

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$5.052

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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Overview

Looking for a reliable solution for automotive ignition applications? Look no further than the FGD3050G2V by Onsemi. This Insulated Gate Bipolar Transistor (IGBT) comes with a built-in TVS diode and resistor, offering superior quality and performance. With a maximum collector-emitter voltage of 500V and a maximum collector current of 32A, this N-channel transistor is designed to handle high-power applications with ease. Trust Onsemi's reputation for excellence and choose the FGD3050G2V for your automotive ignition needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation properties, making the product safe to use in automotive applications.

Polarity or Channel Type: N-CHANNEL

N-channel type allows for efficient switching and control of current flow, enhancing performance in automotive ignition systems.

Configuration: SINGLE WITH BUILT-IN TVS DIODE AND RESISTOR

Built-in TVS diode and resistor help protect the circuit from voltage spikes and provide better reliability for automotive ignition applications.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring reliable performance in high-voltage scenarios.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the IGBT can withstand the heat generated during automotive operation without performance degradation.

Maximum Turn Off Time (toff): 6800 ns

Fast turn-off time enhances efficiency and helps prevent overheating in automotive ignition systems.

Maximum Collector-Emitter Voltage: 500 V

High collector-emitter voltage rating ensures the IGBT can handle voltage spikes and fluctuations common in automotive applications.

Maximum Gate-Emitter Voltage: 10 V

With a high gate-emitter voltage rating, the IGBT can be effectively controlled for precise switching in automotive ignition systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGD3050G2V attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

500 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

6800 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2500 ns

Maximum VCEsat:

1.2 V

Trade Compliance

FGD3050G2V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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