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FGD3325G2-F085

Onsemi

FGD3325G2-F085 by Onsemi

Onsemi's FGD3325G2-F085 is an N-CHANNEL IGBT with built-in TVS diode and resistor, designed for automotive ignition applications. It features a max VCEsat of 1.25V, collector current of 41A, and operating temperature range from -55 to 175 °C. This surface-mount transistor has a rectangular package shape with gull wing terminals.

Median Price

$1.340

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,569 parts In-Stock

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-

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$1.340

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$1.110

10k+ parts

$0.992

6,569

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$1.340

$1.110

$0.992

DigiKey

USA . 5,000 parts In-Stock

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$0.330

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$0.330

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Verical

USA . 4,712 parts In-Stock

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$1.387

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$1.240

4,712

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$1.240

Distributors (In-Stock)

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Vyrian

USA . 1,087 parts In-Stock

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$0.330

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Digiode

USA . 2,328 parts In-Stock

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$1.045

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Flip Electronics

USA . 5,000 parts In-Stock

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DigiKey Marketplace

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Corohmni

South Africa . 447 parts In-Stock

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$0.330

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447

$0.330

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Native Components

USA . 271 parts In-Stock

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$0.659

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271

$0.659

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Northwest PG Solutions

USA . 653 parts In-Stock

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$0.724

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Corphita

USA . 2,611 parts In-Stock

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$0.990

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QUARKTWIN TECHNOLOGY LTD

USA . 15,923 parts In-Stock

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Problanco Electronics

Mexico . 5,773 parts In-Stock

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TANS Electronics

Latvia . 3,986 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 1,597 parts In-Stock

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SupplyDigital Components

Austria . 1,563 parts In-Stock

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Supply Digital

USA . 984 parts In-Stock

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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Overview

Enhance your automotive ignition systems with the FGD3325G2-F085 IGBT by Onsemi. Built to deliver top-notch performance and reliability, this N-CHANNEL transistor features a built-in TVS diode and resistor, making it ideal for automotive ignition applications. With a maximum VCEsat of 1.25V and a maximum collector current of 41A, this IGBT ensures efficient power dissipation while operating at temperatures ranging from -55 °C to 175°C. Trust Onsemi's reputation for quality and innovation, and elevate your automotive electronics with the FGD3325G2-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside the package.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower conduction losses and higher efficiency compared to P-Channel IGBTs.

Configuration: SINGLE WITH BUILT-IN TVS DIODE AND RESISTOR

Having a built-in TVS diode and resistor simplifies the circuit design and provides protection against voltage transients.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring reliability and performance in this application.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation rating, this IGBT can handle high power applications without overheating.

Maximum Collector-Emitter Voltage: 240 V

Ability to withstand high collector-emitter voltages, suitable for various automotive and industrial applications.

Maximum Turn On Time (ton): 11000 ns

Fast turn-on time ensures quick switching, reducing switching losses and improving efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGD3325G2-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

240 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

7300 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2000 ns

Maximum VCEsat:

1.25 V

Trade Compliance

FGD3325G2-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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