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FGD3245G2-F085V

Onsemi

FGD3245G2-F085V by Onsemi

Onsemi's FGD3245G2-F085V is an N-CHANNEL IGBT with built-in diode and resistor, ideal for automotive ignition applications. It features a max VCEsat of 1.25V, collector current of 23A, and operating temperature range from -55 to 175 °C. This surface-mount transistor has a rectangular package shape with gull wing terminals.

Median Price

$2.920

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,611 parts In-Stock

1+ parts

$2.920

100+ parts

$1.307

1k+ parts

$1.082

10k+ parts

$0.884

1,611

$2.920

$1.307

$1.082

$0.884

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,379 parts In-Stock

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$2.400

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2,379

$2.400

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Digiode

USA . 1,129 parts In-Stock

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$2.774

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1,129

$2.774

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Distributors (Availability)

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Corohmni

South Africa . 64 parts In-Stock

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$2.400

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64

$2.400

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Corphita

USA . 593 parts In-Stock

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$2.628

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593

$2.628

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Microchip USA

USA . 9,076 parts In-Stock

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$6.898

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$6.898

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TANS Electronics

Latvia . 7,314 parts In-Stock

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Problanco Electronics

Mexico . 3,053 parts In-Stock

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Northwest PG Solutions

USA . 1,867 parts In-Stock

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SupplyDigital Components

Austria . 1,846 parts In-Stock

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Kulean Microsystems

USA . 1,467 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Native Components

USA . 762 parts In-Stock

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762

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UHIMA Technologies

Türkiye . 51 parts In-Stock

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Overview

Unlock the power of automotive ignition systems with the FGD3245G2-F085V by Onsemi! This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. With a single configuration featuring a built-in diode and resistor, this IGBT is designed for maximum efficiency and performance. Ideal for automotive applications, this surface-mount transistor provides customers with the value, benefits, and advantages they need to take their projects to the next level. Trust in Onsemi and the FGD3245G2-F085V for all your automotive ignition needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor components, ensuring durability and reliability in automotive applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state resistance and higher efficiency, making them suitable for high power applications like automotive ignition.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and save space on the PCB, making this IGBT convenient for automotive ignition applications.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition systems, this IGBT is reliable, efficient, and capable of handling high voltage and current levels.

Maximum Power Dissipation (Abs): 150 W

With a high maximum power dissipation, this IGBT can handle significant power levels without overheating, ensuring reliable operation in automotive ignition systems.

Maximum Collector-Emitter Voltage: 440 V

The high collector-emitter voltage rating allows this IGBT to handle high voltage spikes commonly found in automotive ignition systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGD3245G2-F085V attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

440 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

8100 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

3500 ns

Maximum VCEsat:

1.25 V

Trade Compliance

FGD3245G2-F085V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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