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IRG4PC50KDPBF

Infineon Technologies

IRG4PC50KDPBF by Infineon Technologies

IRG4PC50KDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.2V and a collector-emitter voltage of 600V. It is designed for power control applications, featuring a single configuration with built-in diode and a max power dissipation of 200W. This IGBT has a rectangular package shape, through-hole terminal form, and can operate in temperatures ranging from -55 to 150 °C.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,818 parts In-Stock

1+ parts

$3.680

100+ parts

$3.610

1k+ parts

$3.530

10k+ parts

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9,818

$3.680

$3.610

$3.530

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Distributors (In-Stock)

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Digiode

USA . 375 parts In-Stock

1+ parts

$3.496

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375

$3.496

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Nova Conductors

Japan . 300 parts In-Stock

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$4.858

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300

$4.858

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TME

Poland . 31 parts In-Stock

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$7.620

100+ parts

$5.070

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31

$7.620

$5.070

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Vyrian

USA . 9,624 parts In-Stock

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Chip Stock

USA . 6,100 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,026 parts In-Stock

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Rebound Electronics

UK . 50 parts In-Stock

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North Shore Components

USA . 6 parts In-Stock

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Sensible Micro Corp

USA . 4 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,632 parts In-Stock

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$1.349

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2,632

$1.349

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Semicontronic

India . 9,450 parts In-Stock

1+ parts

$3.130

100+ parts

$3.052

1k+ parts

$3.036

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9,450

$3.130

$3.052

$3.036

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Ampacity Inc.

Singapore . 9,343 parts In-Stock

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$3.130

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9,343

$3.130

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Corphita

USA . 913 parts In-Stock

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$3.312

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913

$3.312

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Modulus Dynamics

Lithuania . 23,729 parts In-Stock

1+ parts

$4.701

100+ parts

$4.513

1k+ parts

$4.325

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23,729

$4.701

$4.513

$4.325

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Corohmni

South Africa . 268 parts In-Stock

1+ parts

$4.701

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268

$4.701

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.858

100+ parts

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$4.616

10k+ parts

$4.518

1,000

$4.858

-

$4.616

$4.518

Continental Prestige Electronics

USA . 80 parts In-Stock

1+ parts

$6.990

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$4.600

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80

$6.990

$4.600

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Perfect Parts

USA . 27,120 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,227 parts In-Stock

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RC Electronics

USA . 9,310 parts In-Stock

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$5.120

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$4.680

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$4.540

9,310

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$5.120

$4.680

$4.540

GreenTree Electronics

Israel . 9,279 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,785 parts In-Stock

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Microchip USA

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Kepictronics

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Argo Parts USA

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Metaverse IC Inc.

Canada . 375 parts In-Stock

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A-Z Elektronik GmbH

Germany . 162 parts In-Stock

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A-Plus Industry Inc.

USA . 106 parts In-Stock

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Elevate your power control applications with the IRG4PC50KDPBF from Infineon Technologies. This N-CHANNEL Insulated Gate Bipolar Transistor offers top-notch quality and reliability, providing a maximum VCEsat of 2.2V and a maximum collector-emitter voltage of 600V. With a single configuration and built-in diode, this transistor is designed for efficiency and performance. Whether you're in the industrial, automotive, or renewable energy sector, this IGBT is a versatile solution that delivers 200W of maximum power dissipation and quick switching times. Trust in Infineon Technologies to bring you cutting-edge technology that enhances your power control systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower conduction losses, making them more efficient in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against voltage spikes, improving system reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency.

Maximum VCEsat: 2.2 V

Low VCEsat minimizes power losses, increasing efficiency and reducing heat generation in the system.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring stable performance in demanding environments.

Maximum Fall Time (tf): 140 ns

Fast fall time improves switching speed and reduces turn-off losses, enhancing overall system performance.

Nominal Turn Off Time (toff): 245 ns

The nominal turn-off time ensures quick switching operation, improving efficiency in power control applications.

No. of Terminals: 3

Three terminals provide simple connections and compatibility with standard circuit designs.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capacity allows for handling large loads, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers easy installation and secure mounting in various electronic systems.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures reliable performance in harsh environments.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating enables the IGBT to handle high voltage applications with ease.

Transistor Element Material: SILICON

Silicon material provides high reliability and long-term stability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures robust gate control and reliable operation in power circuits.

Minimum Operating Temperature: -55 °C

Low operating temperature range allows for use in extreme cold environments without compromising performance.

Maximum Collector Current (IC): 52 A

High collector current rating enables the IGBT to handle high power loads with ease.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures easy gate control and efficient switching operation.

Maximum Turn Off Time (toff): 360 ns

Fast turn-off time improves efficiency and reduces power losses in power control applications.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel finish provides corrosion resistance and ensures reliable connections in various environments.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring, making it easy to integrate into different systems.

Case Connection: COLLECTOR

Collector case connection enhances thermal dissipation and helps in managing heat in high-power applications.

Nominal Turn On Time (ton): 112 ns

Fast turn-on time improves system response and ensures quick switching operation for efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50KDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

140 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

360 ns

Nominal Turn Off Time (toff):

245 ns

Nominal Turn On Time (ton):

112 ns

Maximum VCEsat:

2.2 V

Trade Compliance

IRG4PC50KDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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