Loading...

FP75R12KT3

Infineon Technologies

FP75R12KT3 by Infineon Technologies

Infineon's FP75R12KT3 is an N-CHANNEL IGBT with 1200V VCE, 105A IC, and 355W power dissipation. Ideal for POWER CONTROL applications, it features a turn-off time of 610ns and turn-on time of 340ns. The COMPLEX configuration in a RECTANGULAR package with FLANGE MOUNT style makes it suitable for high-power systems.

Median Price

$127.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$127.840

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$127.840

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 544 parts In-Stock

1+ parts

$115.320

100+ parts

-

1k+ parts

-

10k+ parts

-

544

$115.320

-

-

-

Vyrian

USA . 244 parts In-Stock

1+ parts

$121.390

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$121.390

-

-

-

ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Rutronik

Germany . 40 parts In-Stock

1+ parts

-

100+ parts

$146.490

1k+ parts

-

10k+ parts

-

40

-

$146.490

-

-

Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 737 parts In-Stock

1+ parts

$0.188

100+ parts

-

1k+ parts

-

10k+ parts

$0.180

737

$0.188

-

-

$0.180

Northwest PG Solutions

USA . 896 parts In-Stock

1+ parts

$0.207

100+ parts

-

1k+ parts

-

10k+ parts

$0.182

896

$0.207

-

-

$0.182

Modulus Dynamics

Lithuania . 5,010 parts In-Stock

1+ parts

$0.345

100+ parts

$0.331

1k+ parts

$0.317

10k+ parts

-

5,010

$0.345

$0.331

$0.317

-

Andel Nordic

Denmark . 4,780 parts In-Stock

1+ parts

$21.140

100+ parts

-

1k+ parts

$14.798

10k+ parts

$14.798

4,780

$21.140

-

$14.798

$14.798

Corphita

USA . 173 parts In-Stock

1+ parts

$109.251

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$109.251

-

-

-

Perfect Parts

USA . 2,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,558

-

-

-

-

Authorized Procurement Solutions

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,200

-

-

-

-

Kepictronics

USA . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Overview

Unlock the power of ultimate performance with the FP75R12KT3 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-notch quality and reliability in the category of Insulated Gate Bipolar Transistors (IGBT). This complex N-CHANNEL transistor is designed for power control applications, offering customers unmatched value with its high power dissipation, fast turn-on/off times, and superior thermal management capabilities. Whether you're looking to enhance industrial machinery, renewable energy systems, or electric vehicles, the FP75R12KT3 provides the perfect solution for your power needs. Trust in Infineon Technologies to elevate your projects to new heights of efficiency and performance.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and higher efficiency compared to P-CHANNEL IGBTs, making them a good choice for power control applications.

Maximum VCEsat: 2.15 V

The low saturation voltage (VCEsat) of 2.15 V ensures minimal power loss during operation, leading to improved efficiency of the device.

Maximum Power Dissipation (Abs): 355 W

With a high absolute maximum power dissipation of 355 W, this IGBT can handle high power levels efficiently, making it suitable for power control applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the IGBT to be used in applications where elevated temperatures are encountered without compromising performance.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating of 1200 V provides the IGBT with the ability to handle high voltage levels, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP75R12KT3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FP75R12KT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20