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IKP03N120H2

Infineon Technologies

IKP03N120H2 by Infineon Technologies

IKP03N120H2 by Infineon Technologies is an N-CHANNEL IGBT with 1200V VCE, 9.6A IC, and 62.5W Ptot. Ideal for power control applications due to its single configuration with built-in diode and fast turn-off time of 403ns. Package style is flange mount with through-hole terminals.

Median Price

$1.002

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 38 parts In-Stock

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$1.002

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38

$1.002

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Vyrian

USA . 947 parts In-Stock

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947

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Digiode

USA . 112 parts In-Stock

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112

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.982

100+ parts

-

1k+ parts

$0.943

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1,000

$0.982

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$0.943

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Modulus Dynamics

Lithuania . 18,044 parts In-Stock

1+ parts

$1.238

100+ parts

$1.188

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$1.139

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-

18,044

$1.238

$1.188

$1.139

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AZTECH Wire

Italy . 251 parts In-Stock

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$18.958

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251

$18.958

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Andel Nordic

Denmark . 399 parts In-Stock

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$35.100

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$24.567

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$24.567

399

$35.100

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$24.567

$24.567

Ampacity Inc.

Singapore . 1,037 parts In-Stock

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$54.050

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1,037

$54.050

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A-Z Elektronik GmbH

Germany . 4,739 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,159 parts In-Stock

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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Microchip USA

USA . 1,882 parts In-Stock

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Corphita

USA . 208 parts In-Stock

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the IKP03N120H2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and performance in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor with a built-in diode is perfect for a variety of applications, from industrial machinery to renewable energy systems. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 403ns, this transistor provides superior power dissipation and performance. Experience the benefits of enhanced power control and efficiency with the IKP03N120H2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IGBT, ensuring its durability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state resistance and higher switching speeds compared to P-channel IGBTs, making this product more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and enhances the overall performance of the IGBT by reducing switching losses.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for high power handling and efficient switching.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and integration into various electronic systems.

Nominal Turn Off Time (toff): 403 ns

The fast turn-off time of the IGBT contributes to high efficiency and reduced power losses during switching operations.

Maximum Power Dissipation (Abs): 62.5 W

This IGBT can handle high power dissipation levels, making it suitable for demanding power control applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures without compromising its performance.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating of the IGBT ensures reliable operation in high voltage applications without risk of breakdown.

Maximum Gate-Emitter Voltage: 20 V

The low gate-emitter voltage helps in minimizing the gate drive requirements and improving the overall efficiency of the IGBT.

Maximum Collector Current (IC): 9.6 A

With a high maximum collector current rating, this IGBT can handle substantial current loads in power control circuits.

Maximum Gate-Emitter Threshold Voltage: 3.9 V

The gate-emitter threshold voltage ensures reliable and precise control over the IGBT's switching behavior.

Terminal Finish: MATTE TIN

The matte tin finish provides good electrical conductivity and corrosion resistance for the terminal connections.

Terminal Position: SINGLE

A single terminal position simplifies the connection of the IGBT in circuit layouts, making installation easier and more streamlined.

Case Connection: COLLECTOR

The collector case connection enhances heat dissipation and improves the overall thermal performance of the IGBT.

Nominal Turn On Time (ton): 16.1 ns

The fast turn-on time of the IGBT enables quick switching and efficient power control, reducing switching losses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKP03N120H2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

3.9 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

403 ns

Nominal Turn On Time (ton):

16.1 ns

Trade Compliance

IKP03N120H2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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