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FGH75T65UPD-F085

Onsemi

FGH75T65UPD-F085 by Onsemi

FGH75T65UPD-F085 by Onsemi is an N-CHANNEL IGBT with 650V VCE, 150A IC, and 375W Ptot. Ideal for power control applications due to its fast tr of 71ns and tf of 33ns. Its single configuration with built-in diode makes it suitable for high-power systems requiring efficient switching.

Median Price

$10.040

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 430 parts In-Stock

1+ parts

$8.432

100+ parts

$6.022

1k+ parts

$5.484

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430

$8.432

$6.022

$5.484

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Farnell

UK . 430 parts In-Stock

1+ parts

$9.771

100+ parts

$6.471

1k+ parts

$5.482

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430

$9.771

$6.471

$5.482

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Mouser Electronics

USA . 868 parts In-Stock

1+ parts

$10.040

100+ parts

$5.290

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-

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868

$10.040

$5.290

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DigiKey

USA . 305 parts In-Stock

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$10.040

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$5.941

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$5.042

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305

$10.040

$5.941

$5.042

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Newark

USA . 555 parts In-Stock

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$12.150

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$7.600

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$7.150

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555

$12.150

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$7.150

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Distributors (In-Stock)

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Nova Conductors

Japan . 880 parts In-Stock

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$5.940

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880

$5.940

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Digiode

USA . 542 parts In-Stock

1+ parts

$8.010

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542

$8.010

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Flip Electronics

USA . 98,550 parts In-Stock

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Vyrian

USA . 36 parts In-Stock

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36

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$5.821

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-

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59

$5.821

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Corphita

USA . 2,511 parts In-Stock

1+ parts

$7.589

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2,511

$7.589

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Component Stockers USA

USA . 677 parts In-Stock

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$8.680

100+ parts

$6.200

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677

$8.680

$6.200

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Ampacity Inc.

Singapore . 465 parts In-Stock

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$15.600

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465

$15.600

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Microchip USA

USA . 8,036 parts In-Stock

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$26.124

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8,036

$26.124

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Lixinc

USA . 16,562 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 3,317 parts In-Stock

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Supply Digital

USA . 2,758 parts In-Stock

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2,758

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Problanco Electronics

Mexico . 2,458 parts In-Stock

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SupplyDigital Components

Austria . 1,588 parts In-Stock

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Netroflash

USA . 1,100 parts In-Stock

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$5.821

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$5.643

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$5.524

1,100

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$5.821

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$5.524

UHIMA Technologies

Türkiye . 822 parts In-Stock

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TANS Electronics

Latvia . 586 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of advanced technology with the FGH75T65UPD-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality in their Insulated Gate Bipolar Transistors (IGBT). Designed for power control applications, this single N-channel transistor with a built-in diode offers unrivaled performance and reliability. With a maximum operating temperature of 175°C and a collector-emitter voltage of 650V, this product ensures optimal efficiency and durability. Trust Onsemi to provide cutting-edge solutions that exceed expectations. Elevate your projects with the FGH75T65UPD-F085 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and durability, making the product suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

Enhances the performance and efficiency of power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified setup with the built-in diode, reducing the need for additional components.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance.

Maximum Rise Time (tr): 71 ns

Fast rise time for quick response in switching operations, improving efficiency.

Package Shape: RECTANGULAR

Easy to mount and integrate into electronic circuits.

Terminal Form: THROUGH-HOLE

Provides secure and reliable connections for stable performance.

Maximum Fall Time (tf): 33 ns

Quick fall time ensures rapid switching transitions for efficient power control.

Nominal Turn Off Time (toff): 197 ns

Defined turn off time for precise control in power management applications.

No. of Terminals: 3

Simplified terminal configuration for easy installation and connection.

Maximum Power Dissipation (Abs): 375 W

High power dissipation capability for handling heavy loads with efficiency.

Package Style (Meter): FLANGE MOUNT

Secure mounting option for stability in various operating conditions.

Maximum Operating Temperature: 175 °C

Wide temperature range for versatile usability in different environments.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating for handling high voltage applications.

Transistor Element Material: SILICON

Silicon material offers reliable and consistent performance for extended use.

Maximum Gate-Emitter Voltage: 20 V

Safe voltage rating for the gate-emitter connection, ensuring protection against overloads.

Maximum Collector Current (IC): 150 A

High collector current rating for handling heavy current loads effectively.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

Precise threshold voltage for controlled switch operation in power management systems.

Terminal Finish: MATTE TIN

Durable terminal finish for reliable connections and corrosion resistance.

Terminal Position: SINGLE

Simplified terminal setup for easy integration and connectivity.

Case Connection: COLLECTOR

Collector connection for efficient current handling and control in power circuits.

Nominal Turn On Time (ton): 87 ns

Defined turn on time for accurate power switching operations.

Reference Standard: AEC-Q101

Compliance with industry standards for quality and performance assurance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH75T65UPD-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Fall Time (tf):

33 ns

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

71 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

197 ns

Nominal Turn On Time (ton):

87 ns

Trade Compliance

FGH75T65UPD-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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