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FGH75T65SHDTL4

Onsemi

FGH75T65SHDTL4 by Onsemi

FGH75T65SHDTL4 by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 2.1V and a max power dissipation of 455W. It is designed for power control applications, featuring a max collector-emitter voltage of 650V and a max collector current of 150A. Ideal for high-power systems requiring efficient switching capabilities.

Median Price

$6.845

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 412 parts In-Stock

1+ parts

$6.290

100+ parts

$2.860

1k+ parts

$2.630

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412

$6.290

$2.860

$2.630

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Mouser Electronics

USA . 502 parts In-Stock

1+ parts

$7.400

100+ parts

$3.540

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-

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502

$7.400

$3.540

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DigiKey

USA . 279 parts In-Stock

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$7.400

100+ parts

$4.269

1k+ parts

$3.091

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279

$7.400

$4.269

$3.091

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Element14

Singapore . 412 parts In-Stock

1+ parts

$10.710

100+ parts

$4.450

1k+ parts

$4.430

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412

$10.710

$4.450

$4.430

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Rochester

USA . 3,801 parts In-Stock

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-

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$3.090

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$2.760

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$2.600

3,801

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$3.090

$2.760

$2.600

Flip Electronics (Authorized)

USA . 559 parts In-Stock

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RS (Exports)

UK . 449 parts In-Stock

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$5.481

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449

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$5.481

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Distributors (In-Stock)

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Digiode

USA . 986 parts In-Stock

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$3.258

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-

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986

$3.258

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Vyrian

USA . 1,247 parts In-Stock

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$3.430

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1,247

$3.430

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Chip Stock

USA . 10,716 parts In-Stock

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Flip Electronics

USA . 559 parts In-Stock

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Connector Distribution Corp

USA . 210 parts In-Stock

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210

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Right Parts Inc.

USA . 210 parts In-Stock

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210

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.758

100+ parts

$0.690

1k+ parts

$0.622

10k+ parts

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3,000

$0.758

$0.690

$0.622

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Corohmni

South Africa . 125 parts In-Stock

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$1.503

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125

$1.503

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Corphita

USA . 1,675 parts In-Stock

1+ parts

$3.087

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1,675

$3.087

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Continental Prestige Electronics

USA . 334 parts In-Stock

1+ parts

$6.130

100+ parts

$4.200

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334

$6.130

$4.200

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Native Components

USA . 972 parts In-Stock

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$12.385

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972

$12.385

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Northwest PG Solutions

USA . 4 parts In-Stock

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$13.624

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$12.261

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4

$13.624

$12.261

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Microchip USA

USA . 9,839 parts In-Stock

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$20.692

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$20.692

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iodParts Technologies Inc.

India . 66,291 parts In-Stock

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Infinite Electronics LLP (Excess)

. 18,325 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,917 parts In-Stock

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Lixinc

USA . 10,256 parts In-Stock

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TANS Electronics

Latvia . 5,812 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,288 parts In-Stock

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Kulean Microsystems

USA . 4,836 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,525 parts In-Stock

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SupplyDigital Components

Austria . 3,464 parts In-Stock

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Supply Digital

USA . 2,229 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,023 parts In-Stock

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Kepictronics

USA . 450 parts In-Stock

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450

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Metaverse IC Inc.

Canada . 444 parts In-Stock

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444

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UHIMA Technologies

Türkiye . 370 parts In-Stock

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370

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Perfect Parts

USA . 336 parts In-Stock

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336

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Overview

Unleash the power of innovation with the FGH75T65SHDTL4 by Onsemi. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, thanks to Onsemi's reputation as a leading manufacturer in the industry. Ideal for power control applications, this N-CHANNEL transistor boasts a maximum VCEsat of 2.1V and a maximum collector-emitter voltage of 650V, providing unmatched performance and efficiency. With a maximum power dissipation of 455W and built-in diode configuration, this product is designed to exceed expectations. Upgrade your projects with the FGH75T65SHDTL4 and experience the difference in quality and value today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY material provides good thermal and electrical insulation, making the product reliable and durable.

Configuration

Built-in diode simplifies the circuit design and ensures efficient power control in various applications.

Maximum VCEsat

Low VCEsat value indicates low saturation voltage, leading to reduced power loss and improved efficiency.

Maximum Power Dissipation

High power dissipation capacity allows the IGBT to handle large power loads without overheating.

Maximum Collector-Emitter Voltage

High VCE voltage rating ensures the IGBT can handle high voltage applications with reliability.

Maximum Collector Current (IC)

High collector current rating enables the IGBT to handle large current flows, suitable for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH75T65SHDTL4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.1 V

Trade Compliance

FGH75T65SHDTL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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