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FGH75N60UF

Onsemi

FGH75N60UF by Onsemi

FGH75N60UF by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and a max collector current of 150A. It has a nominal turn-off time of 188ns and a turn-on time of 101ns, making it ideal for power control applications. The transistor comes in a rectangular package style with through-hole terminals for easy installation.

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1k+

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Vyrian

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Digiode

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Native Components

USA . 792 parts In-Stock

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$39.854

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$38.260

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Northwest PG Solutions

USA . 1,893 parts In-Stock

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Problanco Electronics

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TANS Electronics

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A-Z Elektronik GmbH

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SupplyDigital Components

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Kulean Microsystems

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Supply Digital

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Authorized Procurement Solutions

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Corphita

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Alle Elektronik GmbH

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UHIMA Technologies

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Overview

Discover the powerful FGH75N60UF by Onsemi, a top-quality Insulated Gate Bipolar Transistor designed for power control applications. With a maximum collector-emitter voltage of 600V and a collector current of 150A, this single-channel transistor offers superior performance and reliability. Its plastic/epoxy package ensures durability while its N-channel configuration enhances efficiency. Trust in Onsemi's expertise to deliver cutting-edge technology that meets your needs. Upgrade your power control systems with the FGH75N60UF for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in providing insulation and protection to the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer better performance and efficiency compared to P-channel IGBTs, making them a preferred choice for power control applications.

Configuration: SINGLE

The single configuration simplifies the setup and makes it easier to integrate the IGBT into various power control systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers efficient and reliable performance in managing power systems.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this IGBT can withstand high temperature environments and maintain stable performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH75N60UF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

188 ns

Nominal Turn On Time (ton):

101 ns

Trade Compliance

FGH75N60UF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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