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FGH75T65SQDNL4

Onsemi

FGH75T65SQDNL4 by Onsemi

FGH75T65SQDNL4 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a max operating temperature of 175 °C. Ideal for power control applications, it has a max collector-emitter voltage of 650V and can handle a max collector current of 150A.

Median Price

$9.510

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,215 parts In-Stock

1+ parts

$7.290

100+ parts

$4.400

1k+ parts

$4.160

10k+ parts

-

1,215

$7.290

$4.400

$4.160

-

DigiKey

USA . 338 parts In-Stock

1+ parts

$9.510

100+ parts

$6.573

1k+ parts

$5.409

10k+ parts

$5.227

338

$9.510

$6.573

$5.409

$5.227

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$9.510

100+ parts

-

1k+ parts

$5.430

10k+ parts

-

245

$9.510

-

$5.430

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Newark

USA . 1,224 parts In-Stock

1+ parts

$11.690

100+ parts

$8.420

1k+ parts

$8.090

10k+ parts

-

1,224

$11.690

$8.420

$8.090

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Element14

Singapore . 1,215 parts In-Stock

1+ parts

$13.070

100+ parts

$8.120

1k+ parts

$7.960

10k+ parts

-

1,215

$13.070

$8.120

$7.960

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Chip1Stop

Japan . 95 parts In-Stock

1+ parts

$32.100

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95

$32.100

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Rochester

USA . 700 parts In-Stock

1+ parts

-

100+ parts

$4.690

1k+ parts

$4.200

10k+ parts

$3.950

700

-

$4.690

$4.200

$3.950

Verical

USA . 700 parts In-Stock

1+ parts

-

100+ parts

$5.862

1k+ parts

$5.250

10k+ parts

$4.938

700

-

$5.862

$5.250

$4.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,005 parts In-Stock

1+ parts

$4.950

100+ parts

-

1k+ parts

-

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1,005

$4.950

-

-

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Vyrian

USA . 1,237 parts In-Stock

1+ parts

$5.210

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1,237

$5.210

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Infinite Electronics LLP

India . 2,250 parts In-Stock

1+ parts

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2,250

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Distributors (Availability)

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Corphita

USA . 2,239 parts In-Stock

1+ parts

$4.689

100+ parts

-

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10k+ parts

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2,239

$4.689

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-

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Corohmni

South Africa . 321 parts In-Stock

1+ parts

$5.210

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-

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321

$5.210

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Microchip USA

USA . 6,007 parts In-Stock

1+ parts

$29.148

100+ parts

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6,007

$29.148

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Native Components

USA . 225 parts In-Stock

1+ parts

$31.416

100+ parts

-

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10k+ parts

$30.159

225

$31.416

-

-

$30.159

Northwest PG Solutions

USA . 654 parts In-Stock

1+ parts

$34.558

100+ parts

-

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654

$34.558

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Kulean Microsystems

USA . 6,586 parts In-Stock

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6,586

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Problanco Electronics

Mexico . 5,548 parts In-Stock

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5,548

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SupplyDigital Components

Austria . 4,216 parts In-Stock

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4,216

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TANS Electronics

Latvia . 3,524 parts In-Stock

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3,524

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Perfect Parts

USA . 2,626 parts In-Stock

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2,626

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 158 parts In-Stock

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158

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Overview

Experience the power of the FGH75T65SQDNL4 by Onsemi, a top-tier Insulated Gate Bipolar Transistor (IGBT) designed for high-performance power control applications. With a maximum collector-emitter voltage of 650V and maximum operating temperature of 175 °C, this N-channel transistor offers unparalleled efficiency and reliability. Its single configuration with built-in diode and quick turn-on/off times make it ideal for a wide range of industrial and automotive applications. Trust in Onsemi's reputation for quality and innovation, and elevate your projects with the exceptional value and benefits that the FGH75T65SQDNL4 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Offers better efficiency and performance compared to P-channel IGBTs, making it a preferred choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in power management.

Maximum VCEsat: 2.1 V

Low VCEsat helps in reducing power dissipation and improving efficiency in power control circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into existing circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure connection and easy soldering, ensuring reliability in circuit connections.

Nominal Turn Off Time (toff): 467 ns

Fast turn-off time allows for quick switching and better control in power management applications.

No. of Terminals: 4

Sufficient number of terminals for connecting to external circuits and components.

Maximum Power Dissipation (Abs): 375 W

High power dissipation capability allows for handling high power levels in power control applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides a secure and stable mounting option for the transistor in various applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range enables the transistor to operate in harsh environments without compromising performance.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows for handling high voltage levels in power control circuits.

Transistor Element Material: SILICON

Silicon material ensures reliability and performance of the transistor in various operating conditions.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures safe and reliable operation of the transistor in power control applications.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows the transistor to operate in extreme cold conditions without performance degradation.

Maximum Collector Current (IC): 150 A

High collector current rating enables the transistor to handle high current levels in power control circuits.

Maximum Gate-Emitter Threshold Voltage: 5.6 V

Optimal gate-emitter threshold voltage ensures reliable turn-on and turn-off performance in power control applications.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable and corrosion-resistant terminal surface for secure connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and ensures easy integration into existing designs.

Nominal Turn On Time (ton): 113 ns

Fast turn-on time allows for quick response and control in power management applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH75T65SQDNL4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

5.6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

467 ns

Nominal Turn On Time (ton):

113 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FGH75T65SQDNL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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