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MT9V024IA7XTR-DR1

Onsemi

MT9V024IA7XTR-DR1 by Onsemi

MT9V024IA7XTR-DR1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications, it features Tin/Silver/Copper terminal finish and is suitable for various imaging tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,767 parts In-Stock

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Digiode

USA . 374 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,130 parts In-Stock

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$20.390

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$20.390

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Kulean Microsystems

USA . 7,729 parts In-Stock

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TANS Electronics

Latvia . 7,502 parts In-Stock

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SupplyDigital Components

Austria . 6,653 parts In-Stock

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Problanco Electronics

Mexico . 6,617 parts In-Stock

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UHIMA Technologies

Türkiye . 596 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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Corphita

USA . 92 parts In-Stock

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Overview

Capture every moment with the MT9V024IA7XTR-DR1 by Onsemi, a top-of-the-line image sensor that delivers unparalleled quality and performance. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for a wide range of applications. Whether you're looking to enhance your security system, upgrade your automotive camera, or improve your digital imaging device, this sensor offers exceptional value, benefits, and advantages. Trust Onsemi to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for higher resolution images and better detail in captured images

Sensor Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption and high sensitivity, making them efficient for use in various applications

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple materials for terminal finish ensures good conductivity and durability for the sensor

Optical Format (inch): 1/3

The 1/3 inch optical format provides a decent field of view while maintaining good image quality

Termination Type: SOLDER

Solder termination ensures secure connections and reliability in the sensor's operation

Frame Rate: 60 fps

A high frame rate of 60 fps allows for capturing fast-moving objects or scenes with smooth motion

Array Type: FRAME

The frame array type provides a structured arrangement of pixels for efficient image capture and processing

Mounting Feature: SURFACE MOUNT

Surface mounting feature makes it easy to integrate the sensor into various devices and systems

Technical Specifications

Image Sensors MT9V024IA7XTR-DR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100; GLOBAL SHUTTER

Array Type:

FRAME

Frame Rate:

60 fps

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Pixel Size (um):

6X6

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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