Loading...

MT9M024IA3XTM-DRBR

Onsemi

MT9M024IA3XTM-DRBR by Onsemi

MT9M024IA3XTM-DRBR by Onsemi is an image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.

Median Price

$18.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 429 parts In-Stock

1+ parts

-

100+ parts

$15.680

1k+ parts

$14.030

10k+ parts

$13.200

429

-

$15.680

$14.030

$13.200

DigiKey

USA . 429 parts In-Stock

1+ parts

-

100+ parts

$18.160

1k+ parts

-

10k+ parts

-

429

-

$18.160

-

-

Verical

USA . 223 parts In-Stock

1+ parts

-

100+ parts

$19.600

1k+ parts

$17.538

10k+ parts

$16.500

223

-

$19.600

$17.538

$16.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,039 parts In-Stock

1+ parts

$16.587

100+ parts

-

1k+ parts

-

10k+ parts

-

2,039

$16.587

-

-

-

Vyrian

USA . 4,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,944

-

-

-

-

Flip Electronics

USA . 193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

193

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,034 parts In-Stock

1+ parts

$15.714

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

$15.714

-

-

-

Corohmni

South Africa . 494 parts In-Stock

1+ parts

$17.460

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$17.460

-

-

-

Kulean Microsystems

USA . 7,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,875

-

-

-

-

TANS Electronics

Latvia . 1,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,261

-

-

-

-

Problanco Electronics

Mexico . 952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

952

-

-

-

-

UHIMA Technologies

Türkiye . 896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

896

-

-

-

-

Continental Prestige Electronics

USA . 223 parts In-Stock

1+ parts

-

100+ parts

$14.730

1k+ parts

-

10k+ parts

-

223

-

$14.730

-

-

SupplyDigital Components

Austria . 77 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77

-

-

-

-

Overview

Capture every moment in stunning clarity with the MT9M024IA3XTM-DRBR Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that are reliable and efficient. This image sensor is perfect for a wide range of applications, offering crisp images and high performance. With advanced features and a compact design, this sensor provides exceptional value and benefits to customers, making it the perfect choice for all your imaging needs. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 3.75

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage: 1.95 V

Allows for efficient power usage while ensuring optimal performance.

Master Clock: 50 MHz

High master clock frequency facilitates fast image capturing and processing.

Body Width: 9 inch

Compact body width enables easy integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high sensitivity, making them suitable for various applications.

Package Shape or Style: SQUARE

Square package shape ensures efficient use of space and easy mounting.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Horizontal Pixel: 1280

High horizontal pixel count delivers detailed and sharp images.

Output Range: 0.40-1.50V

Wide output range provides flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish ensures excellent conductivity and durability.

Maximum Operating Current: 200 mA

Low operating current helps in reducing power consumption and heat generation.

Dynamic Range: 115 dB

Wide dynamic range enables capturing both bright and dark scenes with high fidelity.

Vertical Pixel: 960

High vertical pixel count enhances image resolution and quality.

Body Length/Diameter: 9 mm

Compact body length/diameter allows for easy integration and installation in different devices.

Optical Format (inch): 1/3

1/3 inch optical format is a common standard ensuring compatibility with various lenses and systems.

Data Rate: 700 Mbps

High data rate enables fast transmission of image data for real-time applications.

Termination Type: SOLDER

Solder termination offers reliable electrical connections for long-term usage.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices.

Frame Rate: 45 fps

High frame rate enables smooth and fluid video capture and playback.

Array Type: SINGLE FRAME

Single frame array design simplifies image processing and reduces complexity.

Sensitivity (V/lx.s): 5.48 V/lx.s

High sensitivity allows for capturing clear images even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount feature enables easy and secure attachment to PCBs and other surfaces.

Technical Specifications

Image Sensors MT9M024IA3XTM-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.35 mm

Body Length/Diameter:

9 mm

Data Rate:

700 Mbps

Dynamic Range:

115 dB

Frame Rate:

45 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

200 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensitivity (V/lx.s):

5.48 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20