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KAI-01050-FBA-JD-BA

Onsemi

KAI-01050-FBA-JD-BA by Onsemi

KAI-01050-FBA-JD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

$677.305

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$269.140

100+ parts

$252.990

1k+ parts

$236.840

10k+ parts

-

3

$269.140

$252.990

$236.840

-

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$277.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$277.000

-

-

-

Arrow

USA . 44 parts In-Stock

1+ parts

$1,077.610

100+ parts

$760.670

1k+ parts

-

10k+ parts

-

44

$1,077.610

$760.670

-

-

Verical

USA . 44 parts In-Stock

1+ parts

$1,077.610

100+ parts

$760.670

1k+ parts

-

10k+ parts

-

44

$1,077.610

$760.670

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,294 parts In-Stock

1+ parts

$263.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,294

$263.150

-

-

-

Vyrian

USA . 8,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,699

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$8.520

100+ parts

-

1k+ parts

-

10k+ parts

-

664

$8.520

-

-

-

Corphita

USA . 1,969 parts In-Stock

1+ parts

$249.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,969

$249.300

-

-

-

Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$265.280

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$265.280

-

-

-

Corohmni

South Africa . 372 parts In-Stock

1+ parts

$277.000

100+ parts

-

1k+ parts

-

10k+ parts

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372

$277.000

-

-

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SupplyDigital Components

Austria . 6,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,974

-

-

-

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TANS Electronics

Latvia . 6,186 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,186

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

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Kulean Microsystems

USA . 4,714 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,714

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-

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Problanco Electronics

Mexico . 691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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691

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UHIMA Technologies

Türkiye . 657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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657

-

-

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Perfect Parts

USA . 177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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177

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Overview

Experience crystal-clear image quality with the KAI-01050-FBA-JD-BA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors that are perfect for a wide range of applications. This sensor boasts a high pixel density and impressive dynamic range, making it ideal for capturing stunning visuals with precision. Whether you're in the medical, automotive, or security industry, this image sensor offers unmatched value, performance, and reliability for all your imaging needs. Elevate your projects with the excellence of Onsemi's KAI-01050-FBA-JD-BA.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size of 5.5x5.5 um allows for high-resolution image capture with fine details.

Maximum Supply Voltage: 15.5 V

The higher maximum supply voltage of 15.5 V provides more power for efficient operation and performance.

Body Width: 20.07 inch

The wide body width of 20.07 inches allows for a larger sensor area and potentially better image quality.

Power Supplies (V): 15

The power supply voltage of 15 V ensures stable and reliable operation of the image sensor.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD (charge-coupled device) image sensor ensures high image quality and low noise in captured images.

Body Height: 3.33 mm

The slim body height of 3.33 mm allows for easy integration into various devices and systems.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers a standard and versatile form factor for easy installation and handling.

Minimum Supply Voltage: 14.5 V

The minimum supply voltage of 14.5 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this image sensor can withstand higher temperature environments.

Horizontal Pixel: 1024

The high horizontal pixel count of 1024 ensures sharp and detailed image capture.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature of -50 °C allows for reliable performance in cold environments.

Dynamic Range: 64 dB

The 64 dB dynamic range allows for capturing a wide range of brightness levels in the image.

Vertical Pixel: 1024

The vertical pixel count of 1024 complements the high horizontal pixel count for a balanced and detailed image.

Body Length/Diameter: 33.02 mm

The moderate body length of 33.02 mm offers a good balance between sensor area and compactness.

Optical Format (inch): 1/2

The 1/2 inch optical format is a standard size that offers compatibility with a wide range of lenses and optical systems.

Termination Type: SOLDER

The solder termination type provides a secure and reliable connection for easy integration with other components.

Array Type: INTERLINE

The interline array type offers fast readout speeds and reduced blooming effect for high-quality imaging.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and stable installation of the image sensor on PCBs or other surfaces.

Technical Specifications

Image Sensors KAI-01050-FBA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Height:

3.33 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1024

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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