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AR0144CSSM20SUKA0-CRBR1

Onsemi

AR0144CSSM20SUKA0-CRBR1 by Onsemi

Onsemi's AR0144CSSM20SUKA0-CRBR1 is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. Ideal for surface mount applications, it features a solder termination type and a 2-wire interface for seamless integration in various imaging systems.

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1k+

AR0144CSSM20SUKA0-CRBR1 by Onsemi
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Vyrian

USA . 7,358 parts In-Stock

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Digiode

USA . 1,271 parts In-Stock

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AZTECH Wire

Italy . 1,010 parts In-Stock

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$14.600

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SupplyDigital Components

Austria . 5,810 parts In-Stock

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TANS Electronics

Latvia . 2,311 parts In-Stock

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Problanco Electronics

Mexico . 1,991 parts In-Stock

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Northwest PG Solutions

USA . 1,909 parts In-Stock

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Corphita

USA . 1,297 parts In-Stock

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UHIMA Technologies

Türkiye . 599 parts In-Stock

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Kulean Microsystems

USA . 416 parts In-Stock

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Corohmni

South Africa . 398 parts In-Stock

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Perfect Parts

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Native Components

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Overview

Unlock the potential of your imaging projects with the AR0144CSSM20SUKA0-CRBR1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that exceed expectations. This sensor's compact design, high frame rate, and impressive pixel resolution make it ideal for a wide range of applications, from automotive cameras to security systems. Experience the value and benefits that this cutting-edge product offers, and take your imaging capabilities to the next level.

Feature Benefit Bullets

Pixel Size (um) - 3X3

Small pixel size allows for high resolution images with detailed information.

Body Width - 5.545 inch

Compact size makes it suitable for a wide range of applications where space is limited.

Sensors or Transducers Type - IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high image quality, making them ideal for various imaging applications.

Body Height - 0.77 mm

Low profile design enables easy integration into systems where space is a constraint.

Package Shape or Style - RECTANGULAR

Rectangular shape facilitates easy mounting and alignment in devices.

Horizontal Pixel - 1280

High horizontal pixel count delivers sharp and detailed images.

Terminal Finish - Tin/Silver/Copper (Sn/Ag/Cu)

Multiple terminal finish options provide flexibility for different soldering techniques.

Vertical Pixel - 800

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter - 5.565 mm

Optimal size for compact devices without compromising on performance.

Optical Format (inch) - 1/4

Standard optical format compatible with a wide range of lenses for various imaging needs.

Termination Type - SOLDER

Solder termination ensures secure and reliable connection for long-term use.

Output Interface Type - 2-WIRE INTERFACE

Efficient 2-wire interface simplifies connectivity and data transfer.

Frame Rate - 60 fps

High frame rate allows for smooth and fluid video recording and streaming.

Array Type - SINGLE FRAME

Single frame array simplifies image processing and data handling.

Mounting Feature - SURFACE MOUNT

Surface mount design enables easy and secure attachment to circuit boards.

Technical Specifications

Image Sensors AR0144CSSM20SUKA0-CRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

SINGLE FRAME

Body Width:

5.545 inch

Body Height:

.77 mm

Body Length/Diameter:

5.565 mm

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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