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AR0135CS2C19SUEA0-DPBR

Onsemi

AR0135CS2C19SUEA0-DPBR by Onsemi

The Onsemi AR0135CS2C19SUEA0-DPBR is a 1/3 inch CMOS image sensor with a square package style. Featuring tin/silver/copper terminal finish, it is ideal for surface mount applications. With dimensions of 9mm x 9mm x 1.55mm, this sensor offers high-quality imaging capabilities for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,252 parts In-Stock

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Digiode

USA . 2,117 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 925 parts In-Stock

1+ parts

$1.125

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925

$1.125

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Northwest PG Solutions

USA . 1,505 parts In-Stock

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$1.237

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1,505

$1.237

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AZTECH Wire

Italy . 525 parts In-Stock

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$13.430

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525

$13.430

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TANS Electronics

Latvia . 7,379 parts In-Stock

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7,379

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Problanco Electronics

Mexico . 7,128 parts In-Stock

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Kulean Microsystems

USA . 4,157 parts In-Stock

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4,157

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SupplyDigital Components

Austria . 2,777 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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509

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Corphita

USA . 167 parts In-Stock

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Corohmni

South Africa . 103 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0135CS2C19SUEA0-DPBR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology and unmatched quality. Designed for a wide range of applications, this image sensor offers superior performance and reliability. Elevate your projects with the value and benefits that this product brings, providing customers with the advantage of capturing crisp, high-resolution images effortlessly.

Feature Benefit Bullets

Body Width: 9 inch

The compact size of the body makes it easy to integrate into various devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors provide high image quality and low power consumption, making them ideal for a wide range of applications.

Body Height: 1.55 mm

The slim design allows for flexibility in installation and reduces overall bulkiness of the device.

Package Shape or Style: SQUARE

The square shape provides a stable mounting option and allows for efficient use of space within the device.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple terminal finish options ensures compatibility with different soldering processes and environments.

Body Length/Diameter: 9 mm

The overall small size of the body ensures compatibility with a wide range of devices and applications.

Optical Format (inch): 1/3

The 1/3 inch optical format provides a good balance between image quality and sensor size, making it suitable for many applications.

Termination Type: SOLDER

The solder termination type ensures a reliable and secure connection to the device, reducing the risk of connectivity issues.

Array Type: FRAME

The frame array type allows for efficient image capture and processing, enabling high-quality output.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and allows for easy integration into various devices.

Technical Specifications

Image Sensors AR0135CS2C19SUEA0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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