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MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XAZU2EG-1SBVA484Q by Xilinx

XAZU2EG-1SBVA484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVA625I by Xilinx

XAZU2EG-1SFVA625I

Xilinx

Xilinx XAZU2EG-1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.85 V supply voltage. This IC has 625 terminals in a GRID ARRAY package style, suitable for industrial applications requiring fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVA625Q by Xilinx

XAZU2EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784I by Xilinx

XAZU2EG-1SFVC784I

Xilinx

Xilinx XAZU2EG-1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C. The package style is GRID ARRAY, FINE PITCH, making it suitable for various applications requiring high performance and reliability.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784Q by Xilinx

XAZU2EG-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVA625I by Xilinx

XAZU2EG-L1SFVA625I

Xilinx

Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVC784I by Xilinx

XAZU2EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVA625I by Xilinx

XAZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVA625Q by Xilinx

XAZU3EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784I by Xilinx

XAZU3EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784Q by Xilinx

XAZU3EG-1SFVC784Q

Xilinx

Xilinx XAZU3EG-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8 mm and nominal voltage of 0.85 V.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVA625I by Xilinx

XAZU3EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVC784I by Xilinx

XAZU3EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-1SFVC784Q by Xilinx

XAZU4EV-1SFVC784Q

Xilinx

Xilinx XAZU4EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125°C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8mm and nominal voltage of 0.85V.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-L1SFVC784I by Xilinx

XAZU4EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-1SFVC784I by Xilinx

XAZU5EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-1SFVC784Q by Xilinx

XAZU5EV-1SFVC784Q

Xilinx

Xilinx XAZU5EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, FINE PITCH with 784 terminals and measures 23x23 mm in size.

S-PBGA-B784

e1

23 mm

4

784

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-L1SFVC784I by Xilinx

XAZU5EV-L1SFVC784I

Xilinx

Xilinx XAZU5EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This package features 784 terminals in a GRID ARRAY, FINE PITCH style, suitable for various uPs and uCs applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDDAAW2 by Texas Instruments

TCI6636K2HDDAAW2

Texas Instruments

TCI6636K2HDDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w supply voltages of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style. Ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAW24 by Texas Instruments

TCI6636K2HDXAAW24

Texas Instruments

TCI6636K2HDXAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The PLASTIC/EPOXY material and BALL terminal form ensure reliable performance in various electronic systems.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAW2 by Texas Instruments

TCI6636K2HDXAAW2

Texas Instruments

TCI6636K2HDXAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a compact square shape measuring 40mm x 40mm, this IC offers efficient processing power in a small footprint design.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAWA24 by Texas Instruments

TCI6636K2HDXAAWA24

Texas Instruments

TCI6636K2HDXAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a supply voltage range of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style, making it suitable for high-performance computing applications. With a compact square shape measuring 40mm x 40mm, this IC is ideal for space-constrained designs requiring advanced processing capabilities.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAWA2 by Texas Instruments

TCI6636K2HDXAAWA2

Texas Instruments

TCI6636K2HDXAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it ideal for high-performance computing applications. With CMOS technology and bottom terminal position, this IC offers advanced functionality in a compact 40x40 mm square shape.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

AX-SFUS-1-01-TB05 by Onsemi

AX-SFUS-1-01-TB05

Onsemi

AX-SFUS-1-01-TB05 by Onsemi is a CMOS MICROPROCESSOR CIRCUIT with 40 terminals in a RECTANGULAR CHIP CARRIER package. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-XQCC-N40

7 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

AX-SFUS-API-1-01-TB05 by Onsemi

AX-SFUS-API-1-01-TB05

Onsemi

AX-SFUS-API-1-01-TB05 by Onsemi is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.6V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.

R-XQCC-N40

7 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

DRA781BRGABFQ1 by Texas Instruments

DRA781BRGABFQ1

Texas Instruments

DRA781BRGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT designed for AUTOMOTIVE applications. It features a 48-bit External Data Bus, operates at up to 32 MHz clock frequency, and supports CAN, I2C, SPI, and UART bus compatibility. With a package size of 15mm x 15mm and a max seated height of 2.82mm, it offers high performance in a compact form factor suitable for automotive electronics.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA781BRGABFRQ1 by Texas Instruments

DRA781BRGABFRQ1

Texas Instruments

The Texas Instruments DRA781BRGABFRQ1 is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at -40 to 125 °C, with a max clock frequency of 32 MHz. Ideal for automotive applications requiring CAN, I2C, SPI, and UART compatibility.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA782BDGABFQ1 by Texas Instruments

DRA782BDGABFQ1

Texas Instruments

DRA782BDGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals, operating at -40 to 125 °C. It supports CAN, I2C, SPI, UART buses and has a clock frequency of 32 MHz. Ideal for automotive applications due to AEC-Q100 screening level.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA782BDGABFRQ1 by Texas Instruments

DRA782BDGABFRQ1

Texas Instruments

DRA782BDGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at up to 32 MHz, compatible with CAN, I2C, SPI, and UART buses. Ideal for automotive applications due to AEC-Q100 screening and wide temperature range from -40 to 125 °C.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA783BRGABFQ1 by Texas Instruments

DRA783BRGABFQ1

Texas Instruments

The Texas Instruments DRA783BRGABFQ1 is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at -40 to 125 °C, with a max clock frequency of 32 MHz. Ideal for automotive applications requiring CAN, I2C, SPI, and UART bus compatibility.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA786BDGABFQ1 by Texas Instruments

DRA786BDGABFQ1

Texas Instruments

DRA786BDGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at up to 32 MHz, compatible with CAN, I2C, SPI, and UART buses. Ideal for automotive applications due to AEC-Q100 screening and wide temperature range (-40 to 125 °C).

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA786BDGABFRQ1 by Texas Instruments

DRA786BDGABFRQ1

Texas Instruments

DRA786BDGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at up to 32 MHz, suitable for automotive applications with CAN, I2C, SPI, and UART compatibility. With a temperature range of -40 to 125 °C, it features TIN SILVER COPPER terminal finish and PLASTIC/EPOXY body material.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA787BRGABFQ1 by Texas Instruments

DRA787BRGABFQ1

Texas Instruments

DRA787BRGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at -40 to 125 °C, with a max clock frequency of 32 MHz. Ideal for automotive applications requiring CAN, I2C, SPI, and UART compatibility.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA787BRGABFRQ1 by Texas Instruments

DRA787BRGABFRQ1

Texas Instruments

DRA787BRGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at up to 32 MHz, compatible with CAN, I2C, SPI, and UART buses. Designed for automotive use, it has a temperature range of -40 to 125 °C and meets AEC-Q100 standards.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DM505LRBABFR by Texas Instruments

DM505LRBABFR

Texas Instruments

The Texas Instruments DM505LRBABFR is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V, featuring I2C, SPI, UART bus compatibility.

I2C; SPI; UART

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DM505LRBABF by Texas Instruments

DM505LRBABF

Texas Instruments

The Texas Instruments DM505LRBABF is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V, featuring I2C, SPI, UART bus compatibility.

I2C; SPI; UART

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DM505MRBABFR by Texas Instruments

DM505MRBABFR

Texas Instruments

The Texas Instruments DM505MRBABFR is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V, featuring I2C, SPI, UART bus compatibility.

I2C; SPI; UART

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DM505MRBABF by Texas Instruments

DM505MRBABF

Texas Instruments

The Texas Instruments DM505MRBABF is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for AUTOMOTIVE applications, it features a CMOS Technology, operates b/w -40 to 125 °C, and supports I2C, SPI, UART bus compatibility.

I2C; SPI; UART

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA780BDGABFQ1 by Texas Instruments

DRA780BDGABFQ1

Texas Instruments

The Texas Instruments DRA780BDGABFQ1 is an automotive-grade microprocessor circuit with 367 terminals in a grid array package. It operates at a max clock frequency of 32 MHz and supports CAN, I2C, SPI, and UART bus compatibility. Ideal for automotive applications requiring high performance and reliability in extreme temperatures (-40 to 125 °C).

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA780BDGABFRQ1 by Texas Instruments

DRA780BDGABFRQ1

Texas Instruments

DRA780BDGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at -40 to 125 °C, with a max clock frequency of 32 MHz. Ideal for automotive applications, supporting CAN, I2C, SPI, and UART bus compatibility.

CAN; I2C; SPI; UART

32 MHz

48

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDSAAW2 by Texas Instruments

TCI6636K2HDSAAW2

Texas Instruments

TCI6636K2HDSAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V, making it ideal for high-performance computing applications. The package measures 40x40 mm and has a max seated height of 3.75 mm, suitable for compact designs requiring advanced CMOS technology.

S-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

AX-SIP-SFEU-1-01-TX30 by Onsemi

AX-SIP-SFEU-1-01-TX30

Onsemi

AX-SIP-SFEU-1-01-TX30 by Onsemi is a 44-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 2-3.6 V. Ideal for applications requiring very thin profile and surface mount compatibility.

R-XBCC-B44

9 mm

3

44

85 Cel

-30 Cel

UNSPECIFIED

HVBCC

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.996 mm

3.6 V

2 V

3 V

YES

CMOS

OTHER

NICKEL GOLD PALLADIUM

BUTT

BOTTOM

30

7 mm

MICROPROCESSOR CIRCUIT

AX-SIP-SFEU-API-1-01-TX30 by Onsemi

AX-SIP-SFEU-API-1-01-TX30

Onsemi

AX-SIP-SFEU-API-1-01-TX30 by Onsemi is a 44-terminal microprocessor circuit with CMOS technology. It operates b/w -30 to 85 °C and has a supply voltage range of 2V to 3.6V. This chip carrier is suitable for applications requiring very thin profile ICs.

R-XBCC-B44

9 mm

3

44

85 Cel

-30 Cel

UNSPECIFIED

HVBCC

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.996 mm

3.6 V

2 V

3 V

YES

CMOS

OTHER

NICKEL GOLD PALLADIUM

BUTT

BOTTOM

30

7 mm

MICROPROCESSOR CIRCUIT

NRF52810-QFAA-T by Nordic Semiconductor Asa

NRF52810-QFAA-T

Nordic Semiconductor Asa

NRF52810-QFAA-T by Nordic Semiconductor Asa is a 48-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring low-profile, surface-mountable chips.

S-XQCC-N48

6 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

3.6 V

1.7 V

3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

6 mm

MICROPROCESSOR CIRCUIT

CC1312R1F3RGZT by Texas Instruments

CC1312R1F3RGZT

Texas Instruments

The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.

DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

S-PQCC-N48

e4

7 mm

3

30

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

81920

1 mm

3.8 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

DLPC3437CZEZ by Texas Instruments

DLPC3437CZEZ

Texas Instruments

DLPC3437CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring a supply voltage range of 1.045V to 1.155V and operating temperatures from -30°C to 85°C.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1952 by Microchip Technology

ATWINC1500-MR210PB1952

Microchip Technology

Microchip Technology's ATWINC1500-MR210PB1952 is a CMOS microprocessor circuit with 28 terminals, operating at up to 48 MHz. It has a supply voltage range of 2.7V to 3.6V and can withstand temperatures from -40°C to 80°C. Ideal for industrial applications requiring high clock frequencies in compact designs.

48 MHz

R-XXMA-N28

21.72 mm

28

80 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

TS 16949

2.11 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1510-MR210PB1952 by Microchip Technology

ATWINC1510-MR210PB1952

Microchip Technology

ATWINC1510-MR210PB1952 by Microchip operates at 48 MHz clock frequency, with a supply voltage range of 2.7V to 3.6V. It is an industrial-grade microprocessor circuit suitable for applications requiring high-speed processing in a compact rectangular package style. With TS 16949 screening level, it offers reliable performance in harsh environments with temperatures ranging from -40°C to 80°C.

48 MHz

R-XXMA-N28

21.72 mm

28

80 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.11 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT