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TCI6636K2HDXAAWA2

Texas Instruments

TCI6636K2HDXAAWA2 by Texas Instruments

TCI6636K2HDXAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it ideal for high-performance computing applications. With CMOS technology and bottom terminal position, this IC offers advanced functionality in a compact 40x40 mm square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,844 parts In-Stock

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5,844

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Digiode

USA . 2,827 parts In-Stock

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2,827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$10.687

100+ parts

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537

$10.687

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Corohmni

South Africa . 301 parts In-Stock

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$20.135

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301

$20.135

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One Stop Electronics

USA . 357 parts In-Stock

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$27.000

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357

$27.000

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Parana Technologies

USA . 263 parts In-Stock

1+ parts

$32.500

100+ parts

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$106.531

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263

$32.500

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$106.531

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DigiPath Technology Company

USA . 805 parts In-Stock

1+ parts

$35.787

100+ parts

$32.924

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805

$35.787

$32.924

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ChromeModa Solutions

Germany . 1,398 parts In-Stock

1+ parts

$36.517

100+ parts

$29.944

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1,398

$36.517

$29.944

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$36.517

100+ parts

$34.691

1k+ parts

$32.865

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1,185

$36.517

$34.691

$32.865

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Corphita

USA . 3,983 parts In-Stock

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3,983

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Overview

Unleash the power of cutting-edge technology with the TCI6636K2HDXAAWA2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering endless possibilities for various applications. Experience unmatched performance and efficiency with this innovative microprocessor circuit, designed to meet your every need. Elevate your projects and streamline your processes with the TCI6636K2HDXAAWA2, delivering unparalleled value and benefits to all customers. Upgrade now and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

The square package shape provides uniformity and ease of handling during installation.

No. of Terminals: 1517

With a high number of terminals, this product can support complex circuit designs and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style allows for efficient heat dissipation and optimal signal routing.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection with other components.

Maximum Seated Height: 3.75 mm

The low maximum seated height allows for compact and slim design of the product.

Width: 40 mm

The moderate width provides a balance between space efficiency and ease of handling.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient manufacturing process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for reliable soldering and ensures product stability.

Length: 40 mm

The equal length and width dimensions create a symmetrical and visually appealing design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type offers advanced processing capabilities and performance for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form allows for easy and reliable connections with other components.

Nominal Supply Voltage: 1 V

The nominal supply voltage provides a standard operating range for consistent performance.

Terminal Pitch: 1 mm

The small terminal pitch enables high-density mounting and compact PCB design.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates good resistance to moisture and environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6636K2HDXAAWA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6636K2HDXAAWA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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