Loading...

DRA787BRGABFRQ1

Texas Instruments

DRA787BRGABFRQ1 by Texas Instruments

DRA787BRGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at up to 32 MHz, compatible with CAN, I2C, SPI, and UART buses. Designed for automotive use, it has a temperature range of -40 to 125 °C and meets AEC-Q100 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,110

-

-

-

-

Digiode

USA . 3,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,335

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 356 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$8.000

-

-

-

AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$17.761

100+ parts

-

1k+ parts

-

10k+ parts

-

512

$17.761

-

-

-

Parana Technologies

USA . 1,627 parts In-Stock

1+ parts

$44.547

100+ parts

$4,136.880

1k+ parts

$40.092

10k+ parts

-

1,627

$44.547

$4,136.880

$40.092

-

DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

$49.052

100+ parts

$45.128

1k+ parts

-

10k+ parts

-

1,721

$49.052

$45.128

-

-

ChromeModa Solutions

Germany . 3,666 parts In-Stock

1+ parts

$50.053

100+ parts

$41.043

1k+ parts

-

10k+ parts

-

3,666

$50.053

$41.043

-

-

IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$50.053

100+ parts

$47.550

1k+ parts

$45.048

10k+ parts

-

2,248

$50.053

$47.550

$45.048

-

Corohmni

South Africa . 138 parts In-Stock

1+ parts

$78.481

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$78.481

-

-

-

Native Components

USA . 43 parts In-Stock

1+ parts

$766.561

100+ parts

$751.230

1k+ parts

$743.564

10k+ parts

$735.898

43

$766.561

$751.230

$743.564

$735.898

Northwest PG Solutions

USA . 758 parts In-Stock

1+ parts

$843.217

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$843.217

-

-

-

Corphita

USA . 4,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,856

-

-

-

-

Microchip USA

USA . 3,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,845

-

-

-

-

Overview

Experience unparalleled performance and reliability with the DRA787BRGABFRQ1 by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that meets the highest standards of quality. This versatile microprocessor circuit offers a wide range of applications, from automotive systems to industrial control. With its advanced features and innovative design, this product provides exceptional value, efficiency, and precision for all your electronic needs. Trust Texas Instruments to provide you with the best solutions for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto circuit boards, saving time and effort in production processes.

Maximum Supply Voltage: 1.11 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating different power sources.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape enables efficient use of PCB space and allows for easier integration into circuit designs.

No. of Terminals: 367

The high number of terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style enhances thermal performance and facilitates efficient heat dissipation, improving overall reliability of the product.

Minimum Supply Voltage: 1.02 V

The low minimum supply voltage allows for operation in low-power environments, optimizing energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh operating conditions, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for consistent performance in extreme temperature environments, enhancing product versatility.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure connection to the PCB, enhancing overall reliability and manufacturability.

Maximum Seated Height: 2.82 mm

The low seated height allows for compact PCB design and facilitates space-saving integration into various electronic devices.

Width: 15 mm

The compact width dimensions enable easy integration into tight spaces, making it suitable for applications with limited space constraints.

External Data Bus Width: 48

Large external data bus width allows for high-speed data transfer and processing capabilities, enhancing overall performance.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast processing speeds, making it suitable for applications requiring real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures reliable solder connections during assembly, contributing to overall product quality.

Peak Reflow Temperature °C: 250

High peak reflow temperature allows for proper soldering of the component onto PCBs, ensuring strong and reliable connections.

Length: 15 mm

The compact length dimensions enable space-saving integration into various electronic devices, making it suitable for compact designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive environments, meeting industry-specific requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides advanced processing capabilities, enabling complex functions and algorithms to be executed efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall energy efficiency and reliability.

Terminal Form: BALL

Ball terminal form provides secure and reliable connection to the PCB, ensuring stable electrical performance in various operating conditions.

Nominal Supply Voltage: 1.06 V

The nominal supply voltage provides a stable operating voltage for consistent performance, enhancing overall reliability of the product.

Bus Compatibility: CAN; I2C; SPI; UART

Multiple bus compatibility options enable flexible integration into diverse communication systems, expanding application possibilities.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on PCBs, optimizing space utilization and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and handling, ensuring reliability in typical manufacturing environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA787BRGABFRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

CAN; I2C; SPI; UART

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

48

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DRA787BRGABFRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20