Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments DRA783BRGABFQ1 is a MICROPROCESSOR CIRCUIT with 367 terminals in a GRID ARRAY package. It operates at -40 to 125 °C, with a max clock frequency of 32 MHz. Ideal for automotive applications requiring CAN, I2C, SPI, and UART bus compatibility.
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The plastic/epoxy material provides durability and protection for the internal components of the IC, ensuring reliable performance over time.
Being surface mountable allows for easier PCB assembly and saves space, making it suitable for compact electronic designs.
The high maximum supply voltage allows for a wide range of compatible power sources, enhancing flexibility in application.
AEC-Q100 screening ensures the IC meets automotive industry standards for quality and reliability, making it suitable for automotive applications.
The square package shape is efficient for PCB layout and space-saving design, making it a practical choice for electronic projects with limited space.
The high number of terminals allows for extensive connectivity options, making it suitable for complex circuit designs requiring numerous connections.
The grid array package style offers high density integration capabilities and efficient heat dissipation, making it suitable for high-performance applications.
The low minimum supply voltage ensures energy-efficient operation and compatibility with a wide range of power sources.
With a high maximum operating temperature, the IC can withstand harsh environmental conditions and operate reliably in demanding applications.
The low minimum operating temperature allows for reliable performance even in extreme cold conditions, making it suitable for a variety of environments.
The terminal finish of tin silver copper ensures good conductivity and corrosion resistance, enhancing the longevity and reliability of the IC.
The bottom terminal position facilitates easy soldering and connection to the PCB, simplifying the assembly process.
The low maximum seated height allows for a compact profile and integration into slim electronic devices, making it suitable for space-constrained designs.
The width of 15mm offers a balanced form factor for easy integration into various electronic projects without compromising on space efficiency.
The wide external data bus width of 48 bits allows for high-speed data transfer and processing, making it ideal for applications requiring rapid data exchange.
The high maximum clock frequency of 32 MHz enables fast processing speeds and real-time responsiveness, making it suitable for time-critical applications.
The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the assembly process.
With a peak reflow temperature of 250°C, the IC can withstand high-temperature soldering processes without compromising its functionality.
The length of 15mm provides a compact size for easy integration into electronic designs without sacrificing performance or functionality.
The automotive temperature grade ensures the IC can operate effectively in automotive environments with varying temperature conditions, making it suitable for automotive applications.
Being a microprocessor circuit, the IC offers advanced processing capabilities and flexibility for various applications, making it a versatile choice for electronics projects.
The CMOS technology provides low power consumption and high-speed processing, making the IC energy-efficient and suitable for battery-powered devices.
The ball terminal form ensures reliable connections and good thermal properties, enhancing the overall performance and reliability of the IC.
The nominal supply voltage of 1.06V offers stable and consistent power delivery, ensuring reliable operation of the IC in various electronic systems.
The IC's compatibility with various bus protocols such as CAN, I2C, SPI, and UART allows for seamless integration into different communication systems, enhancing connectivity options for diverse applications.
The small terminal pitch of 0.65mm enables high-density packaging and space-saving design, making it suitable for compact electronic devices and PCB layouts.
The MSL level of 3 indicates the IC's resistance to moisture-induced damage during storage and assembly, ensuring long-term reliability and performance in humid conditions.
Other Function uPs,uCs & Peripheral ICs DRA783BRGABFQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
Bus Compatibility:
Maximum Clock Frequency:
External Data Bus Width:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
DRA783BRGABFQ1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
1N4148WS
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diodes Incorporated
1N4148WT-7
1N4148WT-7 by Diodes Inc. is a fast recovery rectifier diode with a max reverse recovery time of 0.004 us and a max forward voltage of 1.25 V. It has a package style of small outline, making it suitable for surface mount applications where high-speed switching is required at temperatures ranging from -65 to 150 °C.
Z84C2006PEG
Zilog
Other uPs/uCs/Peripheral ICs; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3;
ATECC608B-SSHCZ-B
Microchip Technology
Microchip ATECC608B-SSHCZ-B is a cryptographic authenticator IC with 8 terminals, CMOS tech, and 1-Wire bus compatibility. It operates b/w -40 to 85°C, suitable for industrial applications requiring secure authentication. The compact rectangular package measures 3.9mm x 4.9mm with a low profile of 1.75mm, making it ideal for space-constrained designs.
ESP32-S3-WROOM-1-N8R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N8R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package style and surface mount capability.
XC7Z045-1FBG676I
Xilinx
The Xilinx XC7Z045-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.
DS28CM00R-A00+T
Analog Devices
DS28CM00R-A00+T by Analog Devices is a CMOS microprocessor circuit with 5 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.62V to 5.25V and comes in a small outline package suitable for industrial applications requiring precise temperature monitoring and control.
XC7Z035-3FFG900E
XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.
EFR32BG24B220F1024IM48-BR
Silicon Labs
EFR32BG24B220F1024IM48-BR by Silicon Labs is a SoC with 48 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 1.71V to 3.8V and comes in a square chip carrier package style. Ideal for IoT devices, wearables, and smart home applications due to its compact size and low power consumption.
10AS066N3F40E2LG
Intel
The Intel 10AS066N3F40E2LG is a Peripheral IC with SoC technology. It operates b/w 0-100°C, with supply voltage range of 0.87-0.93V. With 1517 terminals in a GRID ARRAY package style, it's ideal for applications requiring high performance and integration in compact spaces.
MCIMX6S7CVM08AD
NXP Semiconductors
MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
ESP32-S3-WROOM-1-N16R8
ESP32-S3-WROOM-1-N16R8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V nominal voltage and up to 65°C. Its compact MICROELECTRONIC ASSEMBLY package makes it suitable for IoT devices requiring low power consumption and high performance in a small form factor. With a max supply voltage of 3.6V, it is ideal for applications where space constraints are critical.
MCIMX6S5DVM10AB
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.5 mm;
1SX250HN3F43E2VG
SoC FPGA;
CC1310F128RHBR
CC1310F128RHBR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32 terminals, operating at -40 to 85 °C. It features a CORTEX-M3 CPU, 28672 RAM Bytes, and CMOS technology. Ideal for industrial applications requiring a supply voltage range of 1.8V to 3.8V in a compact SQUARE package style.
XCZU7EG-2FFVF1517I
XCZU7EG-2FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.
SLB9665TT20FW563XUMA3
Infineon's SLB9665TT20FW563XUMA3 is a cryptographic authenticator IC with 28 terminals, operating at -20 to 85 °C. It has a supply voltage range of 3-3.6 V and compact dimensions of 4.4mm x 9.7mm, suitable for secure applications requiring high data protection in small form factors.
CC2541F256RHAR
CC2541F256RHAR by Texas Instruments is a 40-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring low power consumption and versatile peripheral interfaces.
MIMXRT1041XJM5B
SYSTEM ON CHIP;
AM4378BZDNA100
AM4378BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.
ST33HTPH2032AHD1
STMicroelectronics
ST33HTPH2032AHD1 by STMicroelectronics is a 32-terminal chip carrier with cryptographic authenticator technology. Operating b/w -40 to 105°C, it has a terminal pitch of 0.5mm and nominal voltage of 1.8V. Ideal for secure applications requiring compact design and high performance in a square package shape.
XC7Z007S-1CLG400C
The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRA756BPGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
DRA751BLGABCRQ1
DRA746APGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: UNSPECIFIED;
DRA755BLGABCRQ1
DRA752BPGABCRQ1
DRA750BJGABCRQ1
DRA756BPGABCRQ1
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Screening Level: AEC-Q100; Terminal Finish: TIN SILVER COPPER; Technology: CMOS; Moisture Sensitivity Level (MSL): 3;
DRA744BJGABCRQ1
DRA752BPGABCQ1
DRA746BPGABCQ1
DRA755BLGABCQ1
DRA754BJGABCQ1
DRA750BJGABCQ1
DRA756
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
DRA745BLGABCRQ1
DRA751BLGABCQ
DRA744BJGABCQ1
DRA745BLGABCQ1
DRA746BPGABCRQ1
DRA754BJGABCRQ1
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