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AX-SIP-SFEU-1-01-TX30

Onsemi

AX-SIP-SFEU-1-01-TX30 by Onsemi

AX-SIP-SFEU-1-01-TX30 by Onsemi is a 44-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 2-3.6 V. Ideal for applications requiring very thin profile and surface mount compatibility.

Median Price

$8.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

USA . 6,405 parts In-Stock

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VNN

France . 859 parts In-Stock

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Digiode

USA . 665 parts In-Stock

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Continental Prestige Electronics

USA . 3,366 parts In-Stock

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$8.410

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$8.242

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Netroflash

USA . 2,000 parts In-Stock

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$8.410

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$8.242

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Advanced Electronics

New Zealand . 400 parts In-Stock

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$8.578

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$8.578

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$8.578

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AZTECH Wire

Italy . 323 parts In-Stock

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$13.825

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Ampacity Inc.

Singapore . 571 parts In-Stock

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$26.000

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Modulus Dynamics

Lithuania . 2,997 parts In-Stock

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$46.468

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$46.468

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$46.468

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Aztec Data Supply Inc.

USA . 2,935 parts In-Stock

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$48.032

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SupplyDigital Components

Austria . 7,376 parts In-Stock

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Problanco Electronics

Mexico . 6,822 parts In-Stock

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Argo Parts USA

USA . 4,513 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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Kulean Microsystems

USA . 3,139 parts In-Stock

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TANS Electronics

Latvia . 2,658 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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UHIMA Technologies

Türkiye . 745 parts In-Stock

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Corphita

USA . 526 parts In-Stock

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Corohmni

South Africa . 55 parts In-Stock

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Overview

Unleash the power of innovation with the AX-SIP-SFEU-1-01-TX30 by Onsemi, a cutting-edge Peripheral IC that sets new standards in performance and reliability. From its sleek design to its advanced technology, this product offers unmatched quality and precision. Perfect for a wide range of applications, customers can expect seamless integration and superior results. Experience the difference with Onsemi's dedication to excellence and elevate your projects to new heights with the AX-SIP-SFEU-1-01-TX30.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient placement on the PCB, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easily accommodated on PCB layouts.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for various applications.

Nominal Supply Voltage: 3 V

Stable supply voltage ensures consistent performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX-SIP-SFEU-1-01-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-XBCC-B44

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.996 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

AX-SIP-SFEU-1-01-TX30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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