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AX-SIP-SFEU-1-01-TB05

Onsemi

AX-SIP-SFEU-1-01-TB05 by Onsemi

AX-SIP-SFEU-1-01-TB05 by Onsemi is a CMOS MICROPROCESSOR CIRCUIT with 44 terminals, operating b/w -30 to 85 °C. It has a supply voltage range of 2V to 3.6V and is surface mountable. This IC is ideal for applications requiring low-profile chips in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,441 parts In-Stock

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Digiode

USA . 1,825 parts In-Stock

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Problanco Electronics

Mexico . 5,591 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,443 parts In-Stock

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TANS Electronics

Latvia . 2,805 parts In-Stock

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SupplyDigital Components

Austria . 2,702 parts In-Stock

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Corphita

USA . 812 parts In-Stock

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Northwest PG Solutions

USA . 786 parts In-Stock

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UHIMA Technologies

Türkiye . 761 parts In-Stock

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Corohmni

South Africa . 447 parts In-Stock

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Native Components

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Overview

Upgrade your electronic devices with the AX-SIP-SFEU-1-01-TB05 by Onsemi - a top-quality solution for your microprocessor circuit needs. With its advanced technology and reliable performance, this product from a trusted manufacturer offers customers the perfect balance of functionality and value. Ideal for a wide range of applications, this peripheral IC promises seamless integration, low power consumption, and exceptional durability. Elevate your projects with the AX-SIP-SFEU-1-01-TB05 and experience the difference in quality and efficiency today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and increasing efficiency.

Maximum Supply Voltage: 3.6 V

Provides a wide range of operating voltage options, making it versatile in different electrical systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy handling and placement within electronic devices.

No. of Terminals: 44

With a high number of terminals, this product can support complex circuits and connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and integration, catering to various electronic configurations.

Minimum Operating Temperature: -30 °C

Can function reliably in low-temperature environments, expanding its range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Width: 7 mm

Compact width allows for seamless integration into electronic devices with limited space.

Periphal IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, it offers high processing power and efficiency in handling complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX-SIP-SFEU-1-01-TB05 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-XBCC-B44

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.996 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

AX-SIP-SFEU-1-01-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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