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AX-SIP-SFEU-API-1-01-TX30

Onsemi

AX-SIP-SFEU-API-1-01-TX30 by Onsemi

AX-SIP-SFEU-API-1-01-TX30 by Onsemi is a 44-terminal microprocessor circuit with CMOS technology. It operates b/w -30 to 85 °C and has a supply voltage range of 2V to 3.6V. This chip carrier is suitable for applications requiring very thin profile ICs.

Median Price

$10.655

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 130 parts In-Stock

1+ parts

$9.760

100+ parts

$6.370

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130

$9.760

$6.370

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DigiKey

USA . 9 parts In-Stock

1+ parts

$11.550

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9

$11.550

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Distributors (In-Stock)

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Digiode

USA . 566 parts In-Stock

1+ parts

$3.638

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566

$3.638

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Vyrian

USA . 7,524 parts In-Stock

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7,524

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VNN

France . 2,534 parts In-Stock

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2,534

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 72 parts In-Stock

1+ parts

$3.260

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72

$3.260

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Corphita

USA . 2,181 parts In-Stock

1+ parts

$3.447

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2,181

$3.447

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Continental Prestige Electronics

USA . 350 parts In-Stock

1+ parts

$4.040

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350

$4.040

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Corohmni

South Africa . 66 parts In-Stock

1+ parts

$8.730

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66

$8.730

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Modulus Dynamics

Lithuania . 4,360 parts In-Stock

1+ parts

$22.709

100+ parts

$22.709

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$22.709

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4,360

$22.709

$22.709

$22.709

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TANS Electronics

Latvia . 5,909 parts In-Stock

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5,909

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Kulean Microsystems

USA . 5,519 parts In-Stock

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5,519

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Argo Parts USA

USA . 4,607 parts In-Stock

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4,607

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SupplyDigital Components

Austria . 4,378 parts In-Stock

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4,378

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Problanco Electronics

Mexico . 3,804 parts In-Stock

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3,804

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Robosynatics

Brazil . 3,073 parts In-Stock

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3,073

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Lucentia Tech

USA . 3,073 parts In-Stock

1+ parts

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100+ parts

$45.959

1k+ parts

$45.021

10k+ parts

$45.021

3,073

-

$45.959

$45.021

$45.021

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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960

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Discover the cutting-edge AX-SIP-SFEU-API-1-01-TX30 by Onsemi, a top-tier manufacturer known for producing high-quality Other Function uPs,uCs & Peripheral ICs. This innovative product offers unparalleled performance and reliability with its advanced technology and durable design. Perfect for a wide range of applications, this microprocessor circuit boasts a maximum supply voltage of 3.6V and a minimum operating temperature of -30˚C, making it ideal for demanding environments. Elevate your projects with the AX-SIP-SFEU-API-1-01-TX30 and experience the value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Provides a higher voltage tolerance, making the product suitable for a wide range of applications.

Package Shape: RECTANGULAR

Compact and space-saving design that allows for efficient use of board space.

Technology: CMOS

Low power consumption and compatibility with a wide range of devices, enhancing overall performance and energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliability and stability even under high temperature conditions, making the product suitable for various environments.

Nominal Supply Voltage: 3 V

Standard voltage level for compatibility with many other components, ensuring easy integration into existing systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX-SIP-SFEU-API-1-01-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-XBCC-B44

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.996 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

AX-SIP-SFEU-API-1-01-TX30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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