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AX-SIP-SFEU-API-1-01-TB05

Onsemi

AX-SIP-SFEU-API-1-01-TB05 by Onsemi

AX-SIP-SFEU-API-1-01-TB05 by Onsemi is a 44-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 2V to 3.6V. Suitable for applications requiring low-profile RECTANGULAR package style and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,345 parts In-Stock

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Digiode

USA . 467 parts In-Stock

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Native Components

USA . 426 parts In-Stock

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$0.221

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Northwest PG Solutions

USA . 511 parts In-Stock

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Problanco Electronics

Mexico . 8,296 parts In-Stock

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SupplyDigital Components

Austria . 7,149 parts In-Stock

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TANS Electronics

Latvia . 4,174 parts In-Stock

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Kulean Microsystems

USA . 2,683 parts In-Stock

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Corphita

USA . 2,126 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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UHIMA Technologies

Türkiye . 110 parts In-Stock

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Overview

Discover the AX-SIP-SFEU-API-1-01-TB05 by Onsemi, a cutting-edge Other Function uPs,uCs & Peripheral ICs that offers unparalleled quality and reliability. With a maximum supply voltage of 3.6V and a compact rectangular package shape, this product is versatile and efficient for various applications. Onsemi's reputation for excellence ensures that you are getting top-notch performance and durability. Experience seamless integration and superior functionality with the AX-SIP-SFEU-API-1-01-TB05, providing customers with unparalleled value and innovation in the world of microprocessor circuits.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space during assembly.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V provides flexibility in power input options and ensures safe operation within specified limits.

Package Shape: RECTANGULAR

Rectangular package shape aids in efficient placement and orientation on the circuit board, optimizing space utilization and connectivity.

No. of Terminals: 44

Having 44 terminals allows for a wide range of connections and interfaces, enhancing the versatility and functionality of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product is suitable for various environmental conditions and demanding applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures excellent conductivity, corrosion resistance, and long-term reliability in diverse operating environments.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used and compatible with many standard power sources, making integration and power management simple and convenient.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX-SIP-SFEU-API-1-01-TB05 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-XBCC-B44

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.996 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

AX-SIP-SFEU-API-1-01-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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