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DM505LRBABF

Texas Instruments

DM505LRBABF by Texas Instruments

The Texas Instruments DM505LRBABF is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V, featuring I2C, SPI, UART bus compatibility.

Median Price

$36.836

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 339 parts In-Stock

1+ parts

$30.631

100+ parts

$27.227

1k+ parts

$20.020

10k+ parts

-

339

$30.631

$27.227

$20.020

-

Mouser Electronics

USA . 38 parts In-Stock

1+ parts

$43.040

100+ parts

$31.300

1k+ parts

-

10k+ parts

-

38

$43.040

$31.300

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,067 parts In-Stock

1+ parts

$29.099

100+ parts

-

1k+ parts

-

10k+ parts

-

3,067

$29.099

-

-

-

Vyrian

USA . 4,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 769 parts In-Stock

1+ parts

$19.545

100+ parts

-

1k+ parts

$19.547

10k+ parts

-

769

$19.545

-

$19.547

-

DigiPath Technology Company

USA . 2,134 parts In-Stock

1+ parts

$21.522

100+ parts

-

1k+ parts

-

10k+ parts

-

2,134

$21.522

-

-

-

ChromeModa Solutions

Germany . 1,029 parts In-Stock

1+ parts

$21.961

100+ parts

$18.008

1k+ parts

-

10k+ parts

-

1,029

$21.961

$18.008

-

-

IDEA Electronic Components Group

UK . 576 parts In-Stock

1+ parts

$21.961

100+ parts

$20.863

1k+ parts

$19.765

10k+ parts

-

576

$21.961

$20.863

$19.765

-

Corphita

USA . 1,959 parts In-Stock

1+ parts

$27.568

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

$27.568

-

-

-

Corohmni

South Africa . 5,108 parts In-Stock

1+ parts

$32.817

100+ parts

-

1k+ parts

-

10k+ parts

-

5,108

$32.817

-

-

-

Microchip USA

USA . 2,263 parts In-Stock

1+ parts

$70.110

100+ parts

$68.890

1k+ parts

$68.280

10k+ parts

$67.670

2,263

$70.110

$68.890

$68.280

$67.670

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Northwest PG Solutions

USA . 548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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548

-

-

-

-

Native Components

USA . 104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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104

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Texas Instruments with the DM505LRBABF. This innovative microprocessor circuit is designed for automotive applications, offering customers a high-performance solution with a wide range of bus compatibility including I2C, SPI, and UART. With a maximum clock frequency of 32 MHz and a temperature grade suitable for automotive environments, this product ensures optimal performance and durability. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the internal components of the IC, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 1.11 V

The high maximum supply voltage allows for flexibility in power supply options, making it compatible with various systems and applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures automotive-grade quality and reliability, making it suitable for use in automotive electronics where high performance and durability are required.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

No. of Terminals: 367

The high number of terminals provides connectivity for a wide range of input and output functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slug design allows for effective heat dissipation, ensuring optimal performance at high operating temperatures.

Minimum Supply Voltage: 1.02 V

Low minimum supply voltage allows for efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environment conditions, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold conditions, increasing the versatility of the IC for various environments.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and efficient heat dissipation, enhancing overall performance and reliability.

Maximum Seated Height: 2.82 mm

Low seated height allows for compact design and saves space in tight PCB layouts, making it suitable for applications with size constraints.

Width: 15 mm

Compact width dimension fits well in various PCB designs, providing flexibility in layout and integration.

External Data Bus Width: 32

Wide external data bus width of 32 bits allows for high-speed data processing and efficient communication with external devices.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32 MHz enables fast processing speeds and supports smooth operation in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for reliable soldering during manufacturing, ensuring strong and durable connections.

Peak Reflow Temperature °C: 250

High peak reflow temperature of 250°C ensures proper solder melting and bonding, enabling secure attachment to the PCB.

Length: 15 mm

Compact length dimension fits well in various PCB designs, providing flexibility in layout and integration.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable performance in automotive applications where extreme temperature variations are expected.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type provides advanced processing capabilities, making it suitable for complex computing tasks and applications requiring high performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and less prone to interference.

Terminal Form: BALL

Ball terminal form allows for reliable connections and efficient heat dissipation, ensuring stable electrical performance and longevity.

Nominal Supply Voltage: 1.06 V

Stable nominal supply voltage of 1.06 V ensures consistent and reliable power delivery, avoiding fluctuations that could affect performance.

Bus Compatibility: I2C; SPI; UART

Compatibility with I2C, SPI, and UART buses allows for versatile communication with different devices and peripherals, enhancing connectivity options.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm enables high-density packaging and efficient use of board space, making it suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM505LRBABF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DM505LRBABF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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