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DM505MRBABFR

Texas Instruments

DM505MRBABFR by Texas Instruments

The Texas Instruments DM505MRBABFR is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V, featuring I2C, SPI, UART bus compatibility.

Median Price

$33.636

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,500 parts In-Stock

1+ parts

$33.636

100+ parts

$29.898

1k+ parts

$21.984

10k+ parts

-

5,500

$33.636

$29.898

$21.984

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,605 parts In-Stock

1+ parts

$31.954

100+ parts

-

1k+ parts

-

10k+ parts

-

1,605

$31.954

-

-

-

Vyrian

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,122

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$18.690

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$18.690

-

-

-

Corphita

USA . 3,554 parts In-Stock

1+ parts

$30.272

100+ parts

-

1k+ parts

-

10k+ parts

-

3,554

$30.272

-

-

-

Corohmni

South Africa . 3,070 parts In-Stock

1+ parts

$51.067

100+ parts

-

1k+ parts

-

10k+ parts

-

3,070

$51.067

-

-

-

Parana Technologies

USA . 701 parts In-Stock

1+ parts

$54.058

100+ parts

-

1k+ parts

-

10k+ parts

-

701

$54.058

-

-

-

ChromeModa Solutions

Germany . 2,001 parts In-Stock

1+ parts

$60.739

100+ parts

$49.806

1k+ parts

-

10k+ parts

-

2,001

$60.739

$49.806

-

-

IDEA Electronic Components Group

UK . 1,149 parts In-Stock

1+ parts

$60.739

100+ parts

$57.702

1k+ parts

$54.665

10k+ parts

-

1,149

$60.739

$57.702

$54.665

-

Microchip USA

USA . 2,221 parts In-Stock

1+ parts

$70.790

100+ parts

$69.560

1k+ parts

$68.940

10k+ parts

$68.330

2,221

$70.790

$69.560

$68.940

$68.330

Component Stockers USA

USA . 1,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$23.940

10k+ parts

-

1,964

-

-

$23.940

-

Northwest PG Solutions

USA . 1,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,497

-

-

-

-

DigiPath Technology Company

USA . 641 parts In-Stock

1+ parts

-

100+ parts

$54.762

1k+ parts

-

10k+ parts

-

641

-

$54.762

-

-

Native Components

USA . 55 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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55

-

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-

Overview

Experience superior performance and reliability with the DM505MRBABFR by Texas Instruments. As a leader in semiconductor technology, Texas Instruments delivers exceptional quality and innovation. This versatile microprocessor circuit is ideal for automotive applications, offering seamless integration and advanced functionality. With a maximum clock frequency of 32 MHz and wide external data bus width of 32, the DM505MRBABFR provides unmatched value and efficiency. Trust in Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a good balance of durability and cost-effectiveness for a wide range of applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.11 V

Allows for reliable operation within a safe voltage range, reducing the risk of damage to the device.

Screening Level: AEC-Q100

Ensures high quality and reliability for automotive applications, meeting industry standards.

Package Shape: SQUARE

Offers a compact design that optimizes space utilization on the circuit board.

No. of Terminals: 367

Provides ample connectivity options for interfacing with various components and peripherals.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Enhances thermal dissipation and overall performance by effectively managing heat.

Minimum Supply Voltage: 1.02 V

Ensures stable operation even at lower supply voltages, increasing efficiency and flexibility.

Maximum Operating Temperature: 125 °C

Allows for reliable performance in high-temperature environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions, enhancing the product's versatility.

Terminal Finish: TIN SILVER COPPER

Provides a durable and reliable terminal finish for long-term use and improved conductivity.

Terminal Position: BOTTOM

Facilitates easy and secure connections during installation and maintenance.

Maximum Seated Height: 2.82 mm

Allows for a low-profile design that conserves space within devices or systems.

Width: 15 mm

Offers a compact form factor that fits well in various applications with space constraints.

External Data Bus Width: 32

Provides a wide data bus width for high-speed data processing and increased performance.

Maximum Clock Frequency: 32 MHz

Enables fast data processing and execution of commands, improving overall system efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for controlled and efficient soldering processes during manufacturing, ensuring product reliability.

Peak Reflow Temperature °C: 250

Enables high-temperature reflow soldering for robust and reliable connections.

Length: 15 mm

Contributes to the compact form factor of the device, optimizing space utilization on the circuit board.

Temperature Grade: AUTOMOTIVE

Meets stringent automotive industry standards for performance and reliability, making it suitable for automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced microprocessor technology for efficient data processing and control capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

Provides a reliable and secure terminal form factor for easy installation and maintenance.

Nominal Supply Voltage: 1.06 V

Offers a stable and optimal supply voltage for consistent performance and efficiency.

Bus Compatibility: I2C; SPI; UART

Supports multiple communication protocols for versatile connectivity with peripherals and components.

Terminal Pitch: 0.65 mm

Provides a fine terminal pitch for compact design and high-density integration on the circuit board.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of moisture sensitivity, requiring standard handling and storage procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM505MRBABFR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DM505MRBABFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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