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DM505MRBABF

Texas Instruments

DM505MRBABF by Texas Instruments

The Texas Instruments DM505MRBABF is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for AUTOMOTIVE applications, it features a CMOS Technology, operates b/w -40 to 125 °C, and supports I2C, SPI, UART bus compatibility.

Median Price

$43.773

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 603 parts In-Stock

1+ parts

$36.696

100+ parts

$32.618

1k+ parts

$23.984

10k+ parts

-

603

$36.696

$32.618

$23.984

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$50.850

100+ parts

$36.800

1k+ parts

-

10k+ parts

-

2

$50.850

$36.800

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,144 parts In-Stock

1+ parts

$34.861

100+ parts

-

1k+ parts

-

10k+ parts

-

1,144

$34.861

-

-

-

Vyrian

USA . 8,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,344

-

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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900

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

$13.301

100+ parts

-

1k+ parts

$13.806

10k+ parts

-

1,635

$13.301

-

$13.806

-

DigiPath Technology Company

USA . 273 parts In-Stock

1+ parts

$14.646

100+ parts

$13.474

1k+ parts

-

10k+ parts

-

273

$14.646

$13.474

-

-

IDEA Electronic Components Group

UK . 1,152 parts In-Stock

1+ parts

$14.945

100+ parts

$14.198

1k+ parts

$13.450

10k+ parts

-

1,152

$14.945

$14.198

$13.450

-

ChromeModa Solutions

Germany . 874 parts In-Stock

1+ parts

$14.945

100+ parts

$12.255

1k+ parts

-

10k+ parts

-

874

$14.945

$12.255

-

-

Ampacity Inc.

Singapore . 303 parts In-Stock

1+ parts

$31.190

100+ parts

-

1k+ parts

-

10k+ parts

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303

$31.190

-

-

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Corphita

USA . 2,451 parts In-Stock

1+ parts

$33.026

100+ parts

-

1k+ parts

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10k+ parts

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2,451

$33.026

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-

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Corohmni

South Africa . 96 parts In-Stock

1+ parts

$78.132

100+ parts

-

1k+ parts

-

10k+ parts

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96

$78.132

-

-

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Microchip USA

USA . 1,792 parts In-Stock

1+ parts

$83.990

100+ parts

$82.530

1k+ parts

$81.800

10k+ parts

$81.060

1,792

$83.990

$82.530

$81.800

$81.060

Lixinc

USA . 7,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,767

-

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

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50

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments DM505MRBABF. Crafted with precision and expertise, this innovative microprocessor circuit promises top-notch performance and reliability. Ideal for automotive applications, this product boasts a wide range of functionalities and compatibility with I2C, SPI, and UART bus systems. Experience seamless operation and unmatched efficiency with the DM505MRBABF, a game-changer in the world of peripheral ICs. Choose quality, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good thermal and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.11 V

The high maximum supply voltage allows for flexibility in power supply configurations, accommodating different voltage requirements.

Minimum Supply Voltage: 1.02 V

The low minimum supply voltage ensures efficient power consumption, making the product suitable for energy-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making the product suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to operate in extreme cold environments, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finishes provides good conductivity and corrosion resistance, improving the product's longevity.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for high-speed data processing and communication, enhancing the product's performance.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast data processing, making the product suitable for applications requiring real-time data handling.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product's reliability and stability in automotive environments, meeting industry standards.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM505MRBABF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DM505MRBABF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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