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DM505LRBABFR

Texas Instruments

DM505LRBABFR by Texas Instruments

The Texas Instruments DM505LRBABFR is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V, featuring I2C, SPI, UART bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,332

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-

-

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Digiode

USA . 4,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,931

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 621 parts In-Stock

1+ parts

$1.399

100+ parts

-

1k+ parts

-

10k+ parts

-

621

$1.399

-

-

-

Northwest PG Solutions

USA . 1,770 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

1,770

$1.539

-

-

-

One Stop Electronics

USA . 1,144 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,144

$5.000

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AZTECH Wire

Italy . 655 parts In-Stock

1+ parts

$12.935

100+ parts

-

1k+ parts

-

10k+ parts

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655

$12.935

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-

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Corohmni

South Africa . 2,882 parts In-Stock

1+ parts

$29.841

100+ parts

-

1k+ parts

-

10k+ parts

-

2,882

$29.841

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-

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Parana Technologies

USA . 596 parts In-Stock

1+ parts

$37.000

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$37.000

-

-

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DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

$40.742

100+ parts

$37.482

1k+ parts

-

10k+ parts

-

1,783

$40.742

$37.482

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ChromeModa Solutions

Germany . 1,537 parts In-Stock

1+ parts

$41.573

100+ parts

$34.090

1k+ parts

-

10k+ parts

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1,537

$41.573

$34.090

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IDEA Electronic Components Group

UK . 103 parts In-Stock

1+ parts

$41.573

100+ parts

$39.494

1k+ parts

$37.416

10k+ parts

-

103

$41.573

$39.494

$37.416

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Microchip USA

USA . 1,984 parts In-Stock

1+ parts

$60.060

100+ parts

$59.010

1k+ parts

$58.490

10k+ parts

$57.970

1,984

$60.060

$59.010

$58.490

$57.970

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,000

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Corphita

USA . 2,338 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,338

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Overview

Experience superior performance and reliability with the Texas Instruments DM505LRBABFR. As a leader in the industry, Texas Instruments delivers top-notch quality in every product they create. This versatile microprocessor circuit offers a wide range of applications in automotive technology, ensuring seamless integration and efficient operation. Trust in Texas Instruments to provide cutting-edge solutions that meet your needs, offering unmatched value and benefits to customers looking for high-quality components. Elevate your project with the DM505LRBABFR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.11 V

The high maximum supply voltage ensures reliable performance under varying power conditions.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape makes it easy to integrate the product into compact electronic systems.

No. of Terminals: 367

The high number of terminals allows for versatile connectivity options, making the product suitable for complex electronic designs.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with heat sink/slugs helps in efficient heat dissipation, enhancing the product's performance and reliability.

Minimum Supply Voltage: 1.02 V

The low minimum supply voltage ensures energy efficiency and compatibility with low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliability in extreme cold conditions, making the product versatile for various environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures good conductivity and corrosion resistance, increasing the product's longevity.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure connections, enhancing the overall reliability of the product.

Maximum Seated Height: 2.82 mm

The low maximum seated height allows for a compact design and easier integration into electronic systems.

Width: 15 mm

The compact width makes the product suitable for space-constrained applications.

External Data Bus Width: 32

The 32-bit external data bus width allows for high-speed data transfer, enhancing the product's overall performance.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast processing speeds, making the product suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures the product's reliability during soldering processes.

Length: 15 mm

The compact length makes the product suitable for space-constrained designs and applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures that the product can withstand the temperature fluctuations experienced in automotive environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC type provides advanced processing capabilities, making the product suitable for high-performance applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure connections and enables high-speed data transfer, enhancing the product's overall performance.

Nominal Supply Voltage: 1.06 V

The nominal supply voltage ensures stable and consistent power delivery, enhancing the product's reliability.

Bus Compatibility: I2C; SPI; UART

The product's compatibility with I2C, SPI, and UART buses allows for versatile connectivity options and integration with various devices.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density packaging, making the product suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate moisture sensitivity, ensuring reliable performance in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM505LRBABFR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DM505LRBABFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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