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MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVM1502-1LSENFVB1369 by Xilinx

XCVM1502-1LSENFVB1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1369,37X37,36

SQUARE

GRID ARRAY

3.83 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVM1502-1MSENFVB1369 by Xilinx

XCVM1502-1MSENFVB1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1369,37X37,36

SQUARE

GRID ARRAY

3.83 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVM1502-2MLENFVB1369 by Xilinx

XCVM1502-2MLENFVB1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.83 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1369,37X37,36

SQUARE

GRID ARRAY

3.83 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1502-1LLINSVG1369 by Xilinx

XCVC1502-1LLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1502-1MSENSVG1369 by Xilinx

XCVC1502-1MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1502-2LLENSVG1369 by Xilinx

XCVC1502-2LLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1502-2MLINSVG1369 by Xilinx

XCVC1502-2MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1502-2MSENSVG1369 by Xilinx

XCVC1502-2MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1502-1MSINSVG1369 by Xilinx

XCVC1502-1MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2MLINSVG1369 by Xilinx

XCVC1702-2MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

SAM9X60D1G-I/LZB by Microchip Technology

SAM9X60D1G-I/LZB

Microchip Technology

SAM9X60D1G-I/LZB by Microchip offers a 3-5.5V supply range, -40 to 85°C operating temp, and 152 terminals in a square package. Ideal for microprocessor circuits, this CMOS technology-based IC is surface-mountable and features a compact 28x28mm size for various uC applications.

S-XQMA-N152

28 mm

152

85 Cel

-40 Cel

UNSPECIFIED

QMA

SQUARE

MICROELECTRONIC ASSEMBLY

2.45 mm

5.5 V

3 V

3.3 V

YES

CMOS

NO LEAD

.65 mm

QUAD

28 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MLINSVG1369 by Xilinx

XCVE1752-1MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LSENSVG1369 by Xilinx

XCVE1752-2LSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLENSVG1369 by Xilinx

XCVE1752-2MLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSENSVG1369 by Xilinx

XCVE1752-2MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2HSINSVG1369 by Xilinx

XCVE1752-2HSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSINSVG1369 by Xilinx

XCVE1752-2MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LLINSVG1369 by Xilinx

XCVE1752-1LLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSINSVG1369 by Xilinx

XCVE1752-1LSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSENSVG1369 by Xilinx

XCVE1752-1MSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSINSVG1369 by Xilinx

XCVE1752-1MSINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLINSVG1369 by Xilinx

XCVE1752-2MLINSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1369

35 mm

1369

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSENSVG1369 by Xilinx

XCVE1752-1LSENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B1369

35 mm

1369

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LLENSVG1369 by Xilinx

XCVE1752-2LLENSVG1369

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;

S-PBGA-B1369

35 mm

1369

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1369,37X37,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

35 mm

MICROPROCESSOR CIRCUIT

NRF52811-QFAA-T by Nordic Semiconductor Asa

NRF52811-QFAA-T

Nordic Semiconductor Asa

NRF52811-QFAA-T by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. With 48 terminals in a SQUARE package, it's ideal for IoT devices and wearables due to its compact size and low power consumption.

S-XQCC-N48

6 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.24SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.6 V

1.7 V

3 V

YES

CMOS

NO LEAD

.4 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

NRF52811-QCAA-T by Nordic Semiconductor Asa

NRF52811-QCAA-T

Nordic Semiconductor Asa

NRF52811-QCAA-T by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with 32 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.7V to 3.6V and comes in a SQUARE package style suitable for various applications requiring low-profile, high-performance uCs.

S-XQCC-N32

5 mm

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.6 V

1.7 V

3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT