Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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AGB75LC04-QU-E
Amulet Technologies
AGB75LC04-QU-E by Amulet Technologies is a MICROPROCESSOR CIRCUIT with 208 terminals in FLATPACK, FINE PITCH package. It operates b/w -40 to 85 °C with supply voltage range of 1.08V to 1.32V, suitable for INDUSTRIAL applications requiring low power consumption and compact design.
S-PQFP-G208
28 mm
3
208
85 Cel
-40 Cel
PLASTIC/EPOXY
FQFP
QFP208,1.2SQ,20
SQUARE
FLATPACK, FINE PITCH
4.1 mm
1.32 V
1.08 V
1.2 V
YES
CMOS
INDUSTRIAL
GULL WING
.5 mm
QUAD
MICROPROCESSOR CIRCUIT
TDA8029HL/C207,151
NXP Semiconductors
TDA8029HL/C207,151 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE package. It operates b/w -40 to 90 °C and supports power supplies of 1.8/5,3/5 V. Ideal for industrial applications requiring high temperature tolerance and surface mount compatibility.
S-PQFP-G32
1
32
90 Cel
QFP
QFP32,.35SQ,32
FLATPACK
260
1.8/5,3/5
Not Qualified
Other Microprocessor ICs
.8 mm
MFRC53001T/0FE,518
MFRC53001T/0FE,518 by NXP Semiconductors is a microprocessor circuit with a 5V supply and operates b/w -25 °C to 85 °C. It features a compact rectangular package with 32 terminals and supports surface mount technology. Ideal for various peripheral applications, it ensures efficient performance in constrained spaces.
R-PDSO-G32
-25 Cel
SOP
SOP32,.4
RECTANGULAR
SMALL OUTLINE
250
5
40 mA
5 V
OTHER
1.27 mm
DUAL
TDA8026ET/C2,518
TDA8026ET/C2,518 by NXP Semiconductors is a microprocessor circuit with a 3.3V supply and operates b/w -25 °C to 85 °C. It features a fine pitch grid array package with 64 terminals and supports surface mount technology. Ideal for various embedded applications, it ensures reliable performance in compact designs.
S-PBGA-B64
e1
2
64
FBGA
BGA64,8X8,32
GRID ARRAY, FINE PITCH
3.3
260 mA
3.3 V
TIN SILVER COPPER
BALL
BOTTOM
30
TDA8026ET/C2,551
NXP Semiconductors TDA8026ET/C2,551 is a MICROPROCESSOR CIRCUIT with 64 terminals and 3.3V supply voltage. It operates b/w -25 to 85°C, suitable for various applications requiring a fine pitch GRID ARRAY package style. With a peak reflow temp of 260°C, it's ideal for SMT assembly in electronics manufacturing.
TDA8026ET/C2,557
TDA8026ET/C2,557 by NXP Semiconductors is a microprocessor circuit in a square grid array package. It operates at 3.3V with a max current of 260mA and supports temperatures from -25 °C to 85 °C. Ideal for compact electronic applications requiring efficient processing.
MF0ICU1001W/S7DL,0
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified;
70 Cel
DIE OR CHIP
MF0ICU1001W/U7DL,0
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP;
MF0ICU1101W/U7DL,0
MF0ICU1101W/S7DL,0
TDA8035HN/C1,157
NXP Semiconductors TDA8035HN/C1,157 is a CMOS microprocessor circuit with 32 terminals. It operates b/w -25 to 85 °C and requires 2.7-5.5 V supply voltage. This chip carrier is ideal for applications needing very thin profile peripheral ICs in surface-mount technology.
S-PQCC-N32
5 mm
HVQCCN
LCC32,.2SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
220 mA
5.5 V
2.7 V
NO LEAD
MFRC52301HN1,151
MFRC52301HN1,151 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.
e4
QCCN
CHIP CARRIER
3/3.3
10 mA
NICKEL PALLADIUM GOLD
MFRC52301HN1,157
MFRC52301HN1,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.
MFRC52201HN1,118
The NXP Semiconductors MFRC52201HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE CHIP CARRIER package. It operates at -25 to 85 °C and requires 3/3.3V power supply. Ideal for applications requiring contactless communication such as RFID systems and access control devices.
100 mA
MFRC52202HN1,118
The NXP Semiconductors MFRC52202HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals and operates at 3/3.3V. It comes in a PLASTIC/EPOXY square chip carrier package style suitable for surface mount applications. With an operating temperature range of -25 to 85°C, it is ideal for various embedded systems requiring low power consumption.
MFRC63102HN,118
MFRC63102HN,118 by NXP Semiconductors is a microprocessor circuit designed for surface mount applications. It operates at 5V with a max supply current of 20mA and withstands temperatures from -25 °C to 85 °C. Ideal for RFID and NFC solutions, it features a compact chip carrier design.
20 mA
MFRC63102HN,551
MFRC63102HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.
MFRC63102HN,557
MFRC63102HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.
MFRC63102HN,518
MFRC63102HN,518 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for various peripheral applications, it features surface mount technology.
SLRC61002HN,157
SLRC61002HN,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.
3.3/5
SLRC61002HN,557
SLRC61002HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient processing in tight spaces.
SLRC61002HN,551
SLRC61002HN,551 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring reliable performance in harsh environments.
SLRC61002HN,518
SLRC61002HN,518 by NXP Semiconductors is a versatile microprocessor circuit in a square chip carrier package. It operates at 3.3/5V with a max temp of 85 °C and features 32 terminals. Ideal for compact applications requiring efficient power management and surface mount design.
PR601HL/C1,557
PR601HL/C1,557 by NXP Semiconductors is a microprocessor circuit in a square flatpack with 100 gull-wing terminals. It operates b/w -25 °C and 70 °C and supports power supplies of 3.3V and 5V. Ideal for various embedded applications, it features surface mount technology for efficient integration.
S-PQFP-G100
100
QFP100,.63SQ,20
3.3,5
MF0UL1101DUD,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -20 Cel; Package Equivalence Code: DIE OR CHIP;
-20 Cel
COMMERCIAL
MF0UL1101DUF,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Maximum Operating Temperature: 70 Cel;
MF0UL2101DUD,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Qualification: Not Qualified;
MF0UL2101DUF,005
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel;
SL2MOS5301EV,118
MICROPROCESSOR CIRCUIT; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Package Equivalence Code: MODULE(UNSPEC);
MODULE(UNSPEC)
MICROELECTRONIC ASSEMBLY
SL2MOS5401EV,118
MICROPROCESSOR CIRCUIT; Package Equivalence Code: MODULE(UNSPEC); Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
TMS320DM335CZCE216
Texas Instruments
TMS320DM335CZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3-3.3V, it has a peak reflow temp of 260°C and operates b/w 0-85°C. Ideal for applications requiring a low-profile, fine-pitch grid array package style.
FIXED POINT
S-PBGA-B337
13 mm
337
0 Cel
LFBGA
BGA337,19X19,25
GRID ARRAY, LOW PROFILE, FINE PITCH
1.3,1.8,3.3
8192
1.3 mm
Digital Signal Processors
1.365 V
1.235 V
1.3 V
.65 mm
TMS320DM335DZCE135
TMS320DM335DZCE135 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low power consumption and high processing capabilities.
TMS320DM335DZCE216
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
I2C; SPI; UART; USB
OMAPL132BZWTA2E
OMAPL132BZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low power applications. With a compact SQUARE shape and BALL terminal form, it is ideal for space-constrained designs requiring high performance.
ALSO OPERATES AT 1.2 V AND 1.1 V TYP
S-PBGA-B361
16 mm
361
BGA361,19X19,32
1.2,1.8/3.3
1.4 mm
1.05 V
.95 V
1 V
CC2571RHAR
CC2571RHAR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 2-3.6V. Ideal for SPI and UART bus compatibility in industrial applications due to its compact square package design and surface-mount capability.
SPI; UART
0
S-PQCC-N40
6 mm
40
LCC40,.24SQ,20
Other uPs/uCs/Peripheral ICs
3.6 V
2 V
3 V
CC2571RHAT
CC2571RHAT by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 2-3.6V. Suitable for SPI and UART bus compatibility, it comes in a square chip carrier package ideal for industrial applications.
TMS320DM368ZCEDF
TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.
S-PBGA-B338
338
BGA338,19X19,25
1.35,1.8,3.3
1.42 V
1.28 V
1.35 V
CC2540F128RHAT
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
SPI; USART; USB
21
8
COMPARATORS, TIMER(4)
AR1100T-I/MQ
Microchip Technology
Microchip Technology's AR1100T-I/MQ is a CMOS microprocessor circuit with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with supply voltage range of 3.135V to 3.465V. Ideal for industrial applications requiring very thin profile and heat sink compatibility.
ALSO OPERATES AT 5V SUPPLY
S-PQCC-N20
e3
20
LCC20,.20SQ,25
TS 16949
3.465 V
3.135 V
MATTE TIN
OMAPL132BZWT2
OMAPL132BZWT2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low-power applications. With a compact size of 16mm x 16mm and surface-mount capability, it is ideal for space-constrained designs in various electronic devices.
OMAPL132BZWTA2
OMAPL132BZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V and is suitable for applications requiring low profile, fine pitch ICs. With CMOS technology and TIN SILVER COPPER finish, it offers high performance in compact designs.
ALSO OPERATES AT 1.2 V TYP
TMS320DM6441BZWT
TMS320DM6441BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words, operating at -40 to 85°C. It supports Ethernet, I2C, SPI, UART, and USB buses for various applications like multimedia systems and industrial automation due to its low profile grid array package.
ETHERNET; I2C; SPI; UART; USB
48
S-PBGA-B316
316
1.05/1.2,1.8,3.3
20480
1.1 V
TMS320DM6443BZWT
TMS320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. It operates at 1.14-1.26 V, suitable for MICROPROCESSOR CIRCUIT applications like ETHERNET, I2C, SPI, UART, and USB interfaces. The package style is GRID ARRAY with low profile and fine pitch design for compact setups.
1.26 V
1.14 V
CC2543RHMR
CC2543RHMR by Texas Instruments is a CMOS microprocessor circuit with 32 terminals and a package style of chip carrier. It operates b/w -40 to 85 °C, with supply voltages ranging from 2V to 3.6V. Ideal for industrial applications requiring low-profile surface-mount components.
2.5/3.3
.9 mm
CC2543RHMT
CC2543RHMT by Texas Instruments is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with supply voltages of 2-3.6 V. Ideal for industrial applications requiring low-profile surface-mount ICs.
STM32W108HBU61TR
STMicroelectronics
STM32W108HBU61TR by STMicroelectronics is a 32-bit Cortex-M3 microprocessor with 131072 ROM words and 8192 RAM bytes. It operates in industrial temperatures (-40 to 85 °C) and has a max supply current of 150 mA. Ideal for applications requiring high-speed processing and low power consumption.
CORTEX-M3
1.25,1.8,2.5/3.3
131072
FLASH
24 rpm
Microcontrollers
150 mA
TMS320DM368ZCE48
TMS320DM368ZCE48 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for applications requiring low power consumption and high performance in compact designs.
R3910-CFAB-E1B
Onsemi
R3910-CFAB-E1B by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in rectangular package style is ideal for various microelectronic assemblies.
SEATED HGT-NOM
R-XXMA-N25
5.59 mm
25
40 Cel
UNSPECIFIED
NOT SPECIFIED
1.525 mm
1.25 V
3.81 mm
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