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CC2571RHAR

Texas Instruments

CC2571RHAR by Texas Instruments

CC2571RHAR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 2-3.6V. Ideal for SPI and UART bus compatibility in industrial applications due to its compact square package design and surface-mount capability.

Median Price

$5.343

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,739 parts In-Stock

1+ parts

$5.343

100+ parts

$4.356

1k+ parts

$2.904

10k+ parts

-

16,739

$5.343

$4.356

$2.904

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,248 parts In-Stock

1+ parts

$5.076

100+ parts

-

1k+ parts

-

10k+ parts

-

2,248

$5.076

-

-

-

Vyrian

USA . 3,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,393

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 969 parts In-Stock

1+ parts

$2.904

100+ parts

-

1k+ parts

-

10k+ parts

-

969

$2.904

-

-

-

Corphita

USA . 3,133 parts In-Stock

1+ parts

$4.809

100+ parts

-

1k+ parts

-

10k+ parts

-

3,133

$4.809

-

-

-

AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$15.530

100+ parts

-

1k+ parts

-

10k+ parts

-

674

$15.530

-

-

-

Parana Technologies

USA . 1,945 parts In-Stock

1+ parts

$64.737

100+ parts

-

1k+ parts

-

10k+ parts

-

1,945

$64.737

-

-

-

DigiPath Technology Company

USA . 572 parts In-Stock

1+ parts

$71.283

100+ parts

$65.581

1k+ parts

-

10k+ parts

-

572

$71.283

$65.581

-

-

IDEA Electronic Components Group

UK . 1,198 parts In-Stock

1+ parts

$72.738

100+ parts

$69.101

1k+ parts

$65.464

10k+ parts

-

1,198

$72.738

$69.101

$65.464

-

ChromeModa Solutions

Germany . 403 parts In-Stock

1+ parts

$72.738

100+ parts

$59.645

1k+ parts

-

10k+ parts

-

403

$72.738

$59.645

-

-

Native Components

USA . 416 parts In-Stock

1+ parts

$495.077

100+ parts

$485.175

1k+ parts

$480.224

10k+ parts

$475.273

416

$495.077

$485.175

$480.224

$475.273

Northwest PG Solutions

USA . 87 parts In-Stock

1+ parts

$544.584

100+ parts

-

1k+ parts

-

10k+ parts

-

87

$544.584

-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,790

-

-

-

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Overview

Elevate your projects with the CC2571RHAR by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliable products. This versatile IC falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications for your electronic needs. With a maximum supply voltage of 3.6V and a minimum operating temperature of -40°C, this chip carrier boasts exceptional performance and durability. Whether you're working on industrial automation or IoT devices, the CC2571RHAR delivers unmatched value and efficiency to enhance your designs. Experience the advantages of Texas Instruments' quality craftsmanship and innovation with this powerful microprocessor circuit today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and resistance to mechanical stress, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly of electronic circuits, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for increased performance and flexibility in powering the device.

Package Shape: SQUARE

Square package shape enables efficient use of space on circuit boards, optimizing layout design and overall functionality.

Power Supplies (V): 3

Standard power supply voltage of 3V ensures compatibility with a wide range of applications and devices.

No. of Terminals: 40

Higher number of terminals provides greater connectivity options and versatility in circuit configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles offer flexibility in mounting options and thermal management, catering to diverse application requirements.

Minimum Supply Voltage: 2 V

Low minimum supply voltage allows for efficient power usage and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding conditions and industrial settings.

Minimum Operating Temperature: -40 °C

Wide temperature range capability enables operation in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: QUAD

Quad terminal configuration facilitates efficient soldering and connection with other electronic components, simplifying the assembly process.

Maximum Seated Height: 1 mm

Low seated height allows for compact and slim device designs, ideal for space-constrained applications.

Width: 6 mm

Narrow width dimension enables efficient board layout and integration, maximizing space utilization in electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on components during assembly, ensuring high reliability and quality in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for effective soldering and bonding of the ICs, ensuring strong electrical connections.

Length: 6 mm

Compact length dimension contributes to overall miniaturization of electronic devices, enhancing portability and flexibility in design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification guarantees reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit integration offers advanced computing capabilities and versatile functionality for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, optimizing energy efficiency and processing speed.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safe handling during manufacturing and disposal.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation of the product in different operating conditions.

Bus Compatibility: SPI; UART

Support for SPI and UART bus protocols enables seamless communication with other devices and peripherals, enhancing connectivity options.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise soldering, making it suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture exposure during handling and storage, requiring proper precautions to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC2571RHAR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

SPI; UART

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

CC2571RHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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