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TCI6636K2HDDAAW2

Texas Instruments

TCI6636K2HDDAAW2 by Texas Instruments

TCI6636K2HDDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w supply voltages of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style. Ideal for applications requiring high-performance processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,257 parts In-Stock

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Digiode

USA . 311 parts In-Stock

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311

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AZTECH Wire

Italy . 470 parts In-Stock

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$12.660

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470

$12.660

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Corohmni

South Africa . 898 parts In-Stock

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$26.188

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One Stop Electronics

USA . 899 parts In-Stock

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$29.000

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899

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Parana Technologies

USA . 1,613 parts In-Stock

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$43.468

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DigiPath Technology Company

USA . 61 parts In-Stock

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$47.863

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61

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ChromeModa Solutions

Germany . 6,601 parts In-Stock

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$48.840

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$40.049

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IDEA Electronic Components Group

UK . 1,471 parts In-Stock

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$48.840

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$46.398

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$43.956

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Corphita

USA . 2,368 parts In-Stock

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Overview

Discover the power and precision of the TCI6636K2HDDAAW2 by Texas Instruments, a cutting-edge microprocessor circuit that delivers unparalleled performance in a compact package. With Texas Instruments' renowned reputation for quality and innovation, this device is designed to meet the demands of various applications within the Other Function uPs,uCs & Peripheral ICs category. Whether you're looking to enhance your product's functionality or streamline your operations, this versatile solution offers unmatched value, benefits, and advantages to customers seeking top-tier performance. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.05 V

Can operate efficiently within a limited voltage range, making it suitable for low power applications.

Package Shape: SQUARE

Square shape allows for a more compact design and efficient use of space on the circuit board.

No. of Terminals: 1517

Large number of terminals provide versatility and flexibility in connecting to other components or external devices.

Package Style (Meter): GRID ARRAY

Grid array package style offers higher density and improved electrical performance compared to other package styles.

Minimum Supply Voltage: 0.95 V

Ability to operate at low voltages increases energy efficiency and extends battery life in portable devices.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper finish provides good conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier soldering and connection to the circuit board.

Maximum Seated Height: 3.75 mm

Low seated height allows for a slim profile and saves space in compact electronic devices.

Width: 40 mm

Compact width dimension enables integration into small electronic devices or tight spaces on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of thermal damage to the product during assembly.

Peak Reflow Temperature °C: 245

Capable of withstanding high reflow temperatures for reliable and durable solder connections.

Length: 40 mm

Compact length dimension allows for versatile placement on circuit boards or in electronic devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides high performance and processing capabilities for advanced functionalities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: BALL

Ball terminal form facilitates easy and reliable connections during the manufacturing process.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and operation of the product.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high density mounting and compact design of the product.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the product can withstand multiple reflow cycles without risking moisture-related damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6636K2HDDAAW2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6636K2HDDAAW2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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