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MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LC898123F40XC-VH by Onsemi

LC898123F40XC-VH

Onsemi

LC898123F40XC-VH by Onsemi is a MICROPROCESSOR CIRCUIT with 35 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 2.6V to 3.3V, making it ideal for applications requiring high performance and low power consumption.

R-PBGA-B35

e1

3.22 mm

1

35

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.45 mm

3.3 V

2.6 V

2.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.3 mm

MICROPROCESSOR CIRCUIT

UCD3138128APFCR by Texas Instruments

UCD3138128APFCR

Texas Instruments

UCD3138128APFCR by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. This thin-profile IC is ideal for applications requiring ADC channels and a supply voltage range of 3-3.6V.

YES

I2C; SPI; UART

2 MHz

0

S-PQFP-G80

e4

12 mm

3

80

125 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

UCD3138128APFC by Texas Instruments

UCD3138128APFC

Texas Instruments

UCD3138128APFC by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. The package style is flatpack with a thin profile and fine pitch, making it suitable for various applications requiring high-performance processing in compact spaces.

YES

I2C; SPI; UART

2 MHz

0

S-PQFP-G80

e4

12 mm

3

80

125 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MEC1418-I/SZ by Microchip Technology

MEC1418-I/SZ

Microchip Technology

MEC1418-I/SZ by Microchip: 144-terminal IC with CMOS tech, 2-3.6V supply, -40 to 85°C temp range. Ideal for industrial microprocessor circuits due to its very thin profile and fine pitch grid array package style.

S-PBGA-B144

e1

9 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

9 mm

MICROPROCESSOR CIRCUIT

MKW21Z256VHT4 by NXP Semiconductors

MKW21Z256VHT4

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

MKW31Z512VHT4R by NXP Semiconductors

MKW31Z512VHT4R

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

MKW41Z256VHT4 by NXP Semiconductors

MKW41Z256VHT4

NXP Semiconductors

The NXP Semiconductors MKW41Z256VHT4 is a microprocessor circuit with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.71-3.6V. Ideal for industrial applications requiring a surface-mount square package with 48 terminals and nickel gold finish.

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

MKW41Z512VHT4 by NXP Semiconductors

MKW41Z512VHT4

NXP Semiconductors

The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.

S-XQCC-N48

e4

3

48

105 Cel

-40 Cel

UNSPECIFIED

QCCN

SQUARE

CHIP CARRIER

260

3.6 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

QUAD

40

MICROPROCESSOR CIRCUIT

UCD3138ARJAR by Texas Instruments

UCD3138ARJAR

Texas Instruments

UCD3138ARJAR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3-3.6V and ADC channels, it's ideal for various peripheral IC functions in compact designs.

YES

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

UCD3138ARJAT by Texas Instruments

UCD3138ARJAT

Texas Instruments

UCD3138ARJAT by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 3-3.6 V. Ideal for automotive applications, it features ADC channels, quad terminal position, and nickel/palladium/gold/silver finish.

YES

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-4A by Analog Devices

ADSP-SC584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

STWBC-WATR by STMicroelectronics

STWBC-WATR

STMicroelectronics

STWBC-WATR by STMicroelectronics is a compact microprocessor circuit designed for industrial applications, operating b/w -40 °C and 105 °C. It features a max supply voltage of 5.5V, 32 terminals in a very thin profile package. Ideal for space-constrained environments, it ensures reliable performance with low power consumption.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

5.5 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

STWBC-WA by STMicroelectronics

STWBC-WA

STMicroelectronics

STWBC-WA by STMicroelectronics is a compact microprocessor circuit with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 105 °C. Its 32 terminals and very thin profile make it ideal for industrial applications. This CMOS device ensures efficient performance in space-constrained designs.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

5.5 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

MF3ICDH2101DUD/05 by NXP Semiconductors

MF3ICDH2101DUD/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;

X-XUUC-N

70 Cel

-25 Cel

UNSPECIFIED

DIE

WAFER

UNSPECIFIED

UNCASED CHIP

Not Qualified

Other Microprocessor ICs

YES

CMOS

OTHER

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MF3ICDH4101DUD/05 by NXP Semiconductors

MF3ICDH4101DUD/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER;

X-XUUC-N

70 Cel

-25 Cel

UNSPECIFIED

DIE

WAFER

UNSPECIFIED

UNCASED CHIP

Not Qualified

Other Microprocessor ICs

YES

CMOS

OTHER

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MF3ICDH8101DUD/05 by NXP Semiconductors

MF3ICDH8101DUD/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;

X-XUUC-N

70 Cel

-25 Cel

UNSPECIFIED

DIE

WAFER

UNSPECIFIED

UNCASED CHIP

Not Qualified

Other Microprocessor ICs

YES

CMOS

OTHER

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MF3MODH2101DA4/05 by NXP Semiconductors

MF3MODH2101DA4/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; JESD-30 Code: X-PXMA-N;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH2101DA8/05 by NXP Semiconductors

MF3MODH2101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: PLASTIC/EPOXY;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH4101DA8/05 by NXP Semiconductors

MF3MODH4101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 70 Cel;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH8101DA4/05 by NXP Semiconductors

MF3MODH8101DA4/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH8101DA8/05 by NXP Semiconductors

MF3MODH8101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

FT245BL-REEL by FTDI

FT245BL-REEL

FTDI

FT245BL-REEL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V, operating temperature of 0-70°C, and peak reflow temp of 260°C. Ideal for microprocessor circuits, it features CMOS technology and Gull Wing terminal form in a low-profile flatpack package style.

S-PQFP-G32

e3

7 mm

3

32

70 Cel

0 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

260

1.6 mm

5.25 V

4.35 V

5 V

YES

CMOS

COMMERCIAL

MATTE TIN

GULL WING

.8 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

ADSP-21583BBCZ-4A by Analog Devices

ADSP-21583BBCZ-4A

Analog Devices

ADSP-21583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals on a 19x19 mm square body, making it ideal for high-performance applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583CBCZ-4A by Analog Devices

ADSP-21583CBCZ-4A

Analog Devices

ADSP-21583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583KBCZ-4A by Analog Devices

ADSP-21583KBCZ-4A

Analog Devices

ADSP-21583KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at up to 500 MHz, with supply voltage range of 1.05V to 1.15V. Ideal for SPI and UART bus applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-4A by Analog Devices

ADSP-21584BBCZ-4A

Analog Devices

ADSP-21584BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals, 0.8 mm pitch, and measures 19x19 mm for various applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-4A by Analog Devices

ADSP-21584CBCZ-4A

Analog Devices

ADSP-21584CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile grid array package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-4A by Analog Devices

ADSP-21584KBCZ-4A

Analog Devices

ADSP-21584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582BBCZ-4A by Analog Devices

ADSP-SC582BBCZ-4A

Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device comes in a low profile GRID ARRAY package with 349 terminals on a 19mm square body.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582CBCZ-4A by Analog Devices

ADSP-SC582CBCZ-4A

Analog Devices

ADSP-SC582CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582KBCZ-4A by Analog Devices

ADSP-SC582KBCZ-4A

Analog Devices

ADSP-SC582KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C with a supply voltage range of 1.05V to 1.15V, making it ideal for commercial applications requiring high-speed processing in a compact GRID ARRAY package.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-3A by Analog Devices

ADSP-SC583BBCZ-3A

Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC features SPI and UART bus compatibility in a square package with 349 terminals.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-4A by Analog Devices

ADSP-SC583BBCZ-4A

Analog Devices

ADSP-SC583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-3A by Analog Devices

ADSP-SC583CBCZ-3A

Analog Devices

ADSP-SC583CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates in industrial temperature range (-40 to 95 °C) and supports SPI and UART bus compatibility. The package has 349 terminals in a GRID ARRAY style, making it suitable for various applications requiring high performance and low profile design.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-4A by Analog Devices

ADSP-SC583CBCZ-4A

Analog Devices

ADSP-SC583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 95 °C and has a supply voltage range of 1.05V to 1.15V. This SQUARE package IC features 349 terminals in a GRID ARRAY style, making it ideal for SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-3A by Analog Devices

ADSP-SC583KBCZ-3A

Analog Devices

ADSP-SC583KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. The package style is GRID ARRAY, LOW PROFILE, FINE PITCH, making it ideal for compact electronic applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-4A by Analog Devices

ADSP-SC583KBCZ-4A

Analog Devices

ADSP-SC583KBCZ-4A by Analog Devices is a 500 MHz microprocessor circuit with SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. Ideal for applications requiring low profile, fine pitch grid array packages in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-3A by Analog Devices

ADSP-SC584BBCZ-3A

Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device features a low profile grid array package with 349 terminals in a square shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-3A by Analog Devices

ADSP-SC584CBCZ-3A

Analog Devices

ADSP-SC584CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 95 °C, it offers high performance in various environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-4A by Analog Devices

ADSP-SC584CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-3A by Analog Devices

ADSP-SC584KBCZ-3A

Analog Devices

ADSP-SC584KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features 349 terminals in a SQUARE shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-4A by Analog Devices

ADSP-SC584KBCZ-4A

Analog Devices

ADSP-SC584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC is ideal for commercial applications requiring high-speed processing in a compact form factor.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587BBCZ-4B by Analog Devices

ADSP-SC587BBCZ-4B

Analog Devices

ADSP-SC587BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-4B by Analog Devices

ADSP-SC587KBCZ-4B

Analog Devices

ADSP-SC587KBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates b/w 0 to 70 °C and has SPI and UART bus compatibility. This low profile, fine pitch IC with 349 terminals is ideal for commercial applications requiring high-speed processing.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589BBCZ-4B by Analog Devices

ADSP-SC589BBCZ-4B

Analog Devices

ADSP-SC589BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-4B by Analog Devices

ADSP-SC589KBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVB1517E by Xilinx

XCZU11EG-2FFVB1517E

Xilinx

XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1156E by Xilinx

XCZU11EG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT