Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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XCZU17EG-2FFVB1517E
Xilinx
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B1517
e1
4
1517
100 Cel
0 Cel
PLASTIC/EPOXY
BGA
RECTANGULAR
GRID ARRAY
245
.876 V
.825 V
.85 V
YES
CMOS
OTHER
Tin/Silver/Copper (Sn/Ag/Cu)
BALL
BOTTOM
30
MICROPROCESSOR CIRCUIT
XCZU19EG-2FFVB1517E
XCZU19EG-2FFVB1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates b/w 0-100°C, with supply voltage ranging from 0.825-0.876 V. This grid array package is ideal for various applications requiring high-performance processing capabilities in electronic systems.
AWR1642ABIGABLQ1
Texas Instruments
AWR1642ABIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and TIN SILVER COPPER finish.
S-PBGA-B161
10.4 mm
3
161
125 Cel
-40 Cel
TFBGA
SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH
260
1572864
AEC-Q100
1.17 mm
1.32 V
1.14 V
1.2 V
AUTOMOTIVE
TIN SILVER COPPER
.65 mm
AWR1642ABISABLQ1
AWR1642ABISABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14-1.32 V, making it ideal for AUTOMOTIVE applications requiring high performance in a compact GRID ARRAY package.
AWR1642ABISABLRQ1
AWR1642ABISABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package style is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and 0.65 mm pitch.
NOT SPECIFIED
RN2903A-I/RM098
Microchip Technology
Microchip RN2903A-I/RM098 is a CMOS microprocessor IC with 47 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.1-3.6V. Ideal for industrial applications requiring TS16949 screening and surface mount compatibility.
R-XXMA-N47
e4
26.67 mm
47
85 Cel
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
250
TS 16949
3.34 mm
3.6 V
2.1 V
3.3 V
INDUSTRIAL
NICKEL GOLD
NO LEAD
1.27 mm
17.78 mm
DLPC230TZDQQ1
DLPC230TZDQQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range of -40 to 105°C, with a supply voltage ranging from 1.045V to 1.155V. This device comes in a square GRID ARRAY package and is suitable for various applications requiring high-performance microprocessor circuits.
S-PBGA-B324
23 mm
324
105 Cel
2.352 mm
1.155 V
1.045 V
1.1 V
1 mm
DLPC3434CZVB
DLPC3434CZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It features a very thin profile, fine pitch, and CMOS technology. Ideal for applications requiring high processing power in compact spaces.
S-PBGA-B176
7 mm
176
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.4 mm
ADUCM331WFSBCPZ-RL
Analog Devices
ADUCM331WFSBCPZ-RL by Analog Devices is a CMOS microprocessor circuit with SPI bus compatibility. It operates b/w -40 to 115 °C and has a supply voltage range of 3.6V to 18V, making it suitable for industrial applications requiring high performance in a compact package. With AEC-Q100 screening level, this chip carrier is ideal for automotive electronics where reliability and durability are crucial.
SPI
S-XQCC-N32
6 mm
32
115 Cel
HVQCCN
LCC32,.24SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
18 V
.5 mm
QUAD
AT32UC3A4256HHB-C1UR
Microchip AT32UC3A4256HHB-C1UR is a CMOS microprocessor with 100 terminals in a square grid array package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V. Ideal for industrial applications requiring high-performance processing in compact form factors.
S-PBGA-B100
100
BGA100,10X10,25
NT3H1201W0FHKH
NXP Semiconductors
NT3H1201W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 95°C, with a supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring a compact chip carrier package style and surface mount compatibility.
S-PQCC-N8
1.6 mm
1
8
95 Cel
QCCN
CHIP CARRIER
1.7 V
CC-WMX-J97C-TN
Digi International
CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.
S-XBGA-N400
50 mm
400
70 Cel
-20 Cel
LGA
2 mm
CC-WMX-L87C-TE
CC-WMX-L87C-TE by Digi International is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 400 terminals in a SQUARE GRID ARRAY package style, suitable for INDUSTRIAL applications. Operating temperature ranges from -40 to 85°C, making it ideal for various embedded systems requiring high performance.
SIP007AFS001
Samsung
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 271; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
R-XXMA-X271
49 mm
271
3.45 mm
5 V
3.7 V
4.2 V
NO
COMMERCIAL
1.13 mm
36 mm
ATWINC1500-MR210PB1172
ATWINC1500-MR210PB1172 by Microchip operates at 2.7-3.6V, with temp range -40 to 85°C. Its MICROELECTRONIC ASSEMBLY style has 28 terminals and CMOS tech for INDUSTRIAL applications in MICROPROCESSOR CIRCUITS.
R-XXMA-N28
21.72 mm
28
2.113 mm
2.7 V
14.73 mm
ATWINC1500-MR210PB1944
ATWINC1500-MR210PB1944 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.
ATWINC1510-MR210PB1944
Microchip Technology's ATWINC1510-MR210PB1944 is a CMOS microprocessor circuit with 28 terminals. It operates b/w -40 to 85°C, ideal for industrial applications. With a supply voltage range of 2.7V to 3.6V, it offers high performance in compact MICROELECTRONIC ASSEMBLY package style.
MEC1705Q-C2-I/SZ
MEC1705Q-C2-I/SZ by Microchip Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.71-1.89 V. This IC is ideal for industrial applications requiring very thin profile and fine pitch grid array package style.
ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE
S-PBGA-B144
9 mm
144
.8 mm
1.89 V
1.71 V
1.8 V
ATSAMA5D27-WLSOM1
ATSAMA5D27-WLSOM1 by Microchip: Operates at 3-5.5V, -40 to 85°C. With 188 terminals, it's a CMOS microprocessor circuit ideal for various applications requiring high-performance computing in a compact square package.
S-XUUC-N188
188
DIE
UNCASED CHIP
5.5 V
3 V
UPPER
DLPC900AZPC
DLPC900AZPC by Texas Instruments is a MICROPROCESSOR CIRCUIT with 516 terminals, operating at a max clock frequency of 20 MHz. It is used in applications requiring I2C, SPI, UART, and USB bus compatibility.
I2C; SPI; UART; USB
20 MHz
16
S-PBGA-B516
27 mm
9
516
55 Cel
BGA516,26X26,40
2.42 mm
1.15 V
ATWINC1500-MR210PB1140
ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.
SEATED HGT-NOM
ATWINC1500-MR210UB1140
ATWINC1500-MR210UB1140 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style, ideal for industrial applications requiring surface mount technology. With 28 terminals and compact dimensions of 21.72mm x 14.73mm x 2.113mm, it offers high performance in various uP and uC functions.
MKW01Z128CHNR
MICROPROCESSOR CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;
40
DRA784BSGABFQ1
DRA784BSGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at 32 MHz clock frequency. Ideal for automotive applications, it features a max supply voltage of 1.11 V and can withstand temperatures from -40 to 125 °C.
I2C(2), SPI(4), UART(3),
32 MHz
S-PBGA-B367
15 mm
367
FBGA
BGA167,22X22,26
GRID ARRAY, FINE PITCH
2.82 mm
1.11 V
1.02 V
1.06 V
DRA784BSGABFRQ1
DRA784BSGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level.
DRA785BSGABFQ1
The Texas Instruments DRA785BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Designed for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02V to 1.11V.
DRA785BSGABFRQ1
The Texas Instruments DRA785BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V.
DRA788BSGABFQ1
The Texas Instruments DRA788BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level. The package style is GRID ARRAY, FINE PITCH with 367 terminals in PLASTIC/EPOXY material.
DRA788BSGABFRQ1
The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.
ADSP-21584KBCZ-5A
ADSP-21584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications. With a supply voltage range of 1.05V to 1.15V, it can operate in temperatures from 0 °C to 70°C.
SPI; UART
500 MHz
S-PBGA-B349
19 mm
349
LFBGA
BGA529,23X23,32
GRID ARRAY, LOW PROFILE, FINE PITCH
1.5 mm
1.05 V
ADSP-21584BBCZ-5A
ADSP-21584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility.
ADSP-21584CBCZ-5A
ADSP-21584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.
ADSP-SC584KBCZ-5A
ADSP-SC584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style with 349 terminals for various applications.
ADSP-SC587KBCZ-5B
ADSP-SC587KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style and is ideal for commercial applications requiring high-speed processing capabilities.
ADSP-SC587BBCZ-5B
ADSP-SC587BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 85 °C, it's ideal for various embedded system designs.
ADSP-SC589KBCZ-5B
ADSP-SC589KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features a CMOS technology. Ideal for applications requiring high-speed processing in commercial-grade environments.
ADSP-SC589BBCZ-5B
ADSP-SC589BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) and has 349 terminals in a low profile grid array package for various applications.
ADSP-SC584BBCZ-5A
ADSP-SC584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile package style (1.5 mm height) for various applications requiring high-speed processing.
ADSP-SC584CBCZ-5A
ADSP-SC584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has SPI and UART bus compatibility, suitable for INDUSTRIAL applications requiring low profile, fine pitch GRID ARRAY package style.
ECE1200-I/LD
ECE1200-I/LD by Microchip: CMOS microprocessor circuit with 40 terminals, operates b/w -40 to 85 °C. Supply voltage range of 1.71V to 1.89V, in a square chip carrier package for various applications requiring low-profile and surface mount technology.
S-PQCC-N40
5 mm
LCC40,.2SQ,16
.9 mm
XAZU11EG-1FFVF1517Q
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
XAZU7EV-1FBVB900I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
CAN, I2C, SPI, UART
0
S-PBGA-B900
31 mm
900
BGA900,30X30,40
2.97 mm
XAZU11EG-1FFVF1517I
MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30;
XAZU7EV-1FBVB900Q
Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.
WP32C2W6NFEI-400B2
WP32C2W6NFEI-400B2 by Microchip Technology is a CMOS microprocessor circuit with 896 terminals in a grid array package. It features tin silver copper terminal finish and ball terminal form, suitable for various applications requiring high-performance processing capabilities in a compact square package. Ideal for use in advanced electronic devices where space-saving design and efficient processing are essential.
S-PBGA-B896
896
BGA896(UNSPEC)
XCVM1402-1LSEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
S-PBGA-B1760
40 mm
1760
HBGA
BGA1760,42X42,36
GRID ARRAY, HEAT SINK/SLUG
4 mm
.724 V
.676 V
.7 V
.92 mm
XCVM1402-1MLIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
110 Cel
.775 V
.8 V
XCVM1402-1MSIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
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